A New Multi-Mode X-Ray Fluorescence Apparatus for Both Blanket and Pattern Wafer Film Metrology

Yinqiao Feng,Yuxiang Huang,Zhijun Chen,Xujun Li,Trina Wong,Ronghui Luo,Athena Chan,Feng Hong
DOI: https://doi.org/10.1109/CSTIC61820.2024.10532104
2024-03-17
Abstract:Åx-t110, a new X-ray fluorescence (XRF) apparatus, combining two optics systems, has been developed to offer a high-throughput metrology solution with good repeatability and the capability to address inline metrology challenges. Depending on its application, its throughput can be up to 80 WPH (wafers per hour, 5 sites per wafer) with a dynamic precision of less than 0.17% (1 sigma). Moreover, its specially designed micro spot optics enable it to measure pattern wafers, making it a great complementary approach to optical spectroscopy technology when facing metallic film metrology challenges. In this paper, we introduce the main configuration of this apparatus. Additionally, certain application cases are discussed to demonstrate its capabilities.
Engineering,Materials Science,Physics
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