Oxygen-Assisted Anisotropic Chemical Etching of MoSe2 for Enhanced Phototransistors

Qing Zhang,Wanzhen He,Lin Li,Dechao Geng,Zhiping Xu,Huipeng Chen,Wei Chen,Wenping Hu
DOI: https://doi.org/10.1021/acs.chemmater.2c00694
IF: 10.508
2022-01-01
Chemistry of Materials
Abstract:The etching process can serve as an effective top-down approach that facilitates direct construction of tunedpatterns, reversely studying growth mechanisms and furtherinducing unexpected physical properties. Currently, etchingbehaviors of monolayer transition-metal dichalcogenides (TMDs)have been rarely explored and the intrinsic etching mechanism stillneeds to be fully elucidated. Here, we demonstrate a facile andcontrollable oxygen-assisted anisotropic chemical etching of two-dimensional (2D) materials. Taking MoSe2as an example, a seriesof well-defined etched patterns can be fabricated by precisely modulating the pretreatment time of oxygen plasma and the etchingtime. Atomic characterization exhibits that the edges of etched patterns are mainly zigzag-terminated. Density functional theorycalculations highly agree with the experimental results, indicating an energy preference for zigzag edges. The as-produced MoSe2flakes can be used as part of heterojunctions to display intriguing optoelectronic properties. Thefield-effect transistor based on as-etched MoSe2flakes and the 2D poly(3-hexylthiophene-2,5-diyl) crystal shows a distinct enhanced ambipolar photoresponse. Ourstrategy offers a new direction for preparing patterned 2D TMDs with desirable characteristics, opening the door for facilitating thedevelopment of optoelectronics.
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