Abstract:A numerical modeling study, based on 3D finite element method (FEM) simulation and 1D analytical solutions, has been carried out to evaluate the capabilities of two ac methods for measuring in-plane thermal conductivity of thin film deposited on the back of a suspended SiNx membrane setup. Two parallel metal strips are present on the top of the dielectric membrane. One strip (S1) serves as both heater and thermometer, while another one (S2) acts as thermometer only. For a modified phase shift (MPS) method, it is crucial to extract the in-plane thermal diffusivity from the phase shift of the temperature oscillation on S2. It was found that the frequency window for carrying out the data fitting became narrower as the in-plane thermal diffusivity of the composite membrane (<math>α∥,C</math>) increased, primarily due to the failure of the semi-infinite width assumption in the low frequency region. To ensure the validity of the method, the upper limit of <math>α∥,C</math> should not exceed ~1.8 × 10−5 m2 s−1 for the specific membrane dimension under consideration (1 × 1 mm2). On the other hand, inspired by a modified Ångström method proposed by Zhu recently, we suggest a new data reduction methodology which takes advantage of the phase shift on both S1 and S2 as well as the amplitude on S1. Based on the simulation results, it is expected that the non-ideality associated with the three "observables" may be at least partially canceled out. Therefore, the frequency window selection for carrying out the data fitting is not sensitive to the magnitude of <math>α∥,C</math> and the upper limit of measurable <math>αC,∥</math> can be further increased with respect to the MPS method. For typical specimen films whose in-plane thermal conductivity ranges from 0.84 W m−1 K−1 to 50 W m−1 K−1, the method proposed here yields a theoretical measurement uncertainty of less than 5%.

Experimental Measurement of Thermal Conductivities in a Thin Heterogeneous Structure of Thermal Diodes

A Method For Measuring Thermal Conductivity Of Low-Dimensional Materials Based On Dc Heating

Design and Experimental Analysis of a Novel Thermal Diode with Asymmetric Heat Transfer Inspired by Feather

Research On Thermal Conductivity Measurement Of Submicrometer-Scale Silicon Dioxide Film In Thermal Flow Sensor By Micro-Raman Technique

Thermal Conductivity Measurements of Ultra-Thin Single Crystal Silicon Films Using Improved Structure

Thermal Diodes Based on Fractal Structures with Tunable Thermal Threshold

Micro‐scale, In‐plane Thermal Conductivity of PEDOT:PSS Thin Films Measured by a Suspended Membrane Device

Prediction and Measurement of Thermal Transport Across Interfaces Between Semiconductor and Adjacent Layers

Unidirectional Heat and Fluid Transfer Performances of a Thermal Diode with Fishbone-Microstructure Wicks

Three-Sensor 3Ω-2Ω Method for the Simultaneous Measurement of Thermal Conductivity and Thermal Boundary Resistance in Film-on-Substrate Heterostructures

Three-Sensor 2ω Method with Multi-directional Layout: A General Methodology for Measuring Thermal Conductivity of Solid Materials

Unidirectional heat and fluid transfer performances of thermal diode with fishbone-microstructure wicks

Asymmetric Heat Transfer with Linear Conductive Metamaterials

Ultra-soft Thermal Diodes Enabled by Dual-Alkane-Based Phase Change Composites

Numerical modeling of in-plane thermal conductivity measurement methods based on a suspended membrane setup

Thermal Conductivity Measurement of Supported Thin Film Materials Using the 3$ω$ method

Cross-plane Thermal Conductivity and Thermal Diffusivity Measurement in Thin-Films by One-Dimensional Thermal Wave Method

Experimental Study of Single-phase Change Material Thermal Diode Based on Calcium Chloride Hexahydrate

An improved steady-state method for measuring the thermal contact resistance and bulk thermal conductivity of thin-walled materials having a sub-millimeter thickness

Flash DSC characterization of thermal contact resistance and cross-plane thermal conductivity of micrometer-thin films