Design and Simulation of 3D Antenna Based on Conical Via Structure

Ziyu Liu,Junhao Wang,Zhiyuan Zhu,Lin Chen,Qingqing Sun
DOI: https://doi.org/10.1109/icept52650.2021.9568099
2021-01-01
Abstract:In this paper, a 3D monopole antenna based on TSV structure applied for network on chip (NoC) is proposed to increase the bandwidth and reduce the resonant frequency of short-distance antenna. The 3D antenna has the signal vias and the grounding vias. To optimize the performance, the cylindrical and conical signal vias are compared. Then the upper and lower radius size of the conical via is analyzed to reveal their influence on the bandwidth and resonant frequency. The return loss/ insert loss were used to characterize the performance of 3D antenna simulated by HFSS. The transmission distance between the transmitting and receiving antenna was 10 mm. The antenna with conical via of 1 mil upper radius and 7 mil lower radius had an minimum insertion loss of -7.46 dB at 26.4 GHz, which had a return loss of -24.08 dB. Besides, the conical antenna above also had two bandwidths with one bandwidth of 2.22 GHz between 25.45 GHz and 27.67 GHz, and the other bandwidth of 2.54 GHz between 30.15 GHz and 32.69 GHz. The 3D antenna also had working frequencies less than 32 GHz.
What problem does this paper attempt to address?