Fatigue Crack Growth Behavior of TA15/TC4 Dissimilar Laminates Fabricated by Diffusion Bonding

Tianle Li,Huiping Wu,Bin Wang,Sheng Li,Xifeng Li,Jun Chen
DOI: https://doi.org/10.1016/j.ijfatigue.2021.106646
IF: 5.489
2022-01-01
International Journal of Fatigue
Abstract:Fatigue crack growth behavior of TA15/TC4 dissimilar laminates produced by diffusion bonding is studied. A sound bonding interface and fine equiaxed microstructure are obtained to improve fatigue damage tolerance with uncompromised tensile properties. TA15 alloy in the dissimilar laminates exhibits a higher fatigue crack growth resistance. EBSD analysis confirms that more α recrystallization occurs in TA15 alloy, which contributes to the relatively random crystallographic orientation and therefore the lower crack propagation rate. Local α grains characterized by high basal or prismatic Schmid factors are activated for plastic deformation accompanied by observation of dislocation lines and tangles. This study sheds light on a simple method to improve the damage tolerance by fabricated dissimilar laminate of diffusion bonding.
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