Resistive Switching Characteristics of HfOx/Al2O3 Nano-multilayers Structure Memristor Fabricated by Atomic Layer Deposition.

Jian Liu,Ke Wang,Xiaolong Zhou,Xiaopeng Xiao,Yongming Tang,Zhongyuan Ma,Kunji Chen
DOI: https://doi.org/10.1109/asicon52560.2021.9620227
2021-01-01
Abstract:We report a novel HfOx/Al2O3 nano-multilayers (nano-MLs) structure memristor with ultrafast program/erase speed (50 ns), large memory window (~104) and good pulse switching endurance (106 cycles) characteristics. Besides, 8 discrete resistance states can be successfully realized by controlling the Reset stop voltage (VReset-stop). This indicates the potential capability to store 3 bits in each memristive cell. Through the analysis of the current-voltage (I-V) curves, a progressive decrease in conductance followed by a quantized conductance and finally a multilevel Reset phenomenon can be clearly observed in the Reset process. The Reset dynamics in our designed Ti/HfOx-Al2O3 nano-MLs/Pt memristor can be interpreted as the evolution process of conductive filament as follows: gradually getting thinner followed by being atomic point contact, and eventually disconnecting layer by layer.
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