MAX Phase Ti2AlN for HfO2 Memristors with Ultra‐Low Reset Current Density and Large On/Off Ratio
Fabia F. Athena,Moses Nnaji,Diego Vaca,Mengkun Tian,Wolfgang Buchmaier,Khandker Akif Aabrar,Samuel Graham,Suman Datta,Satish Kumar,Eric M. Vogel
DOI: https://doi.org/10.1002/adfm.202316290
IF: 19
2024-02-10
Advanced Functional Materials
Abstract:Ti2AlN MAX phase thin‐film in HfO2 memristors enables ultra‐low reset current‐density, high on‐off ratio, multi‐level functionality, and strong endurance. The unique properties of Ti2AlN MAX phase, such as low thermal, high electrical conductivity, and ultra‐thin layered structure, contribute to these advancements, demonstrating its potential for energy‐efficient devices for sustainable AI. A Ti2AlN MAX phase layered thin film electrode and oxygen getter layer for HfO2‐based two‐terminal memristors is presented. The Ti2AlN/HfOx/Ti memristor devices exhibit enhanced resistive switching performance, including an ultra‐low reset current density ( 200 million) as compared to conventional TiN and other alternative materials based memristors. Experimental measurements and modeling suggest that the distinctive combination of low thermal conductivity, high electrical conductivity, and unique ultra‐thin layer‐by‐layer structure of the Ti2AlN MAX phase thin film contribute to this exceptional performance with good reproducibility and stability. The results demonstrate for the first‐time the potential of this innovative sputtered MAX phase material for engineering energy‐efficient, high‐density non‐volatile digital, and analog memory devices aimed toward next‐generation sustainable artificial intelligence.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology