Whisker Nucleation by Slip-Assisted Grain Rotation During Thermal Cycling
Congying Wang,Xiaorong Cai,Marisol Koslowski,John Blendell,Carol Handwerker
DOI: https://doi.org/10.1007/s11837-023-06366-5
2024-01-25
JOM
Abstract:As a result of thermal cycling, polycrystalline tin films with a large in-plane grain size relative to film thickness on copper substrates show grain boundary (GB) sliding, creep, yielding, and nucleation of shallow grains that become whiskers. These microstructural changes occur near GBs, with different types of changes for different GBs. To understand these different phenomena, it is important to identify local microstructural changes and signatures of deformation mechanisms on free surfaces as deformation progresses, particularly in how they affect the formation of shallow grains. This study does that by characterizing the evolution of morphological, crystallographic, and curvature changes near GBs in large-grained Sn films during rapid thermal cycling. The observed responses include (1) nucleation of new grains accompanied by local yielding as indicated by slip band formation and grain misorientation changes, (2) GB sliding and diffusion, and (3) localized GB migration, with GB sliding and near-GB rotation occurring earlier than other phenomena. The angles between slip planes and observed slip traces suggested that dislocations moved along activated slip planes to form new GBs. These results on large-grained bicrystal films provide insights into the complex stress relaxation behavior of columnar polycrystalline tin films under the same thermal cycling conditions.
materials science, multidisciplinary,metallurgy & metallurgical engineering,mining & mineral processing,mineralogy