Intermetallics-induced directional growth of Sn whiskers in Sn-3.5Ag coating on Al substrate
Shuang Tian,Yushuang Liu,Qiang Ma,Peigen Zhang,Jian Zhou,Feng Xue,ZhengMing Sun
DOI: https://doi.org/10.1016/j.apsusc.2020.148135
IF: 6.7
2021-02-01
Applied Surface Science
Abstract:<p>In this paper, the directional growth behavior of Sn whiskers was found to be associated with the interfacial γ-Ag<sub>2</sub>Al IMCs at Sn-3.5Ag/Al interface. A 100 μm thick columnar structured Sn-3.5Ag coating consisted of β-Sn phases and γ-Ag<sub>2</sub>Al phases was fabricated on Al substrate. The as-formed interfacial IMCs between Sn-3.5Ag and Al were confirmed as γ-Ag<sub>2</sub>Al and μ-Ag<sub>3</sub>Al. After aging treatment, the growth direction of Sn whiskers was found to be consistent. μ-Ag<sub>3</sub>Al phases transformed into γ-Ag<sub>2</sub>Al. The newly formed hexagonal γ-Ag<sub>2</sub>Al grew out of the IMCs layer and provided the out-of-plane stress for whisker growth. Ag atoms diffused into Sn sub-grain boundaries and formed γ-Ag<sub>2</sub>Al IMCs leading to the formation of in-plane stress. The <em>c</em>-axis of the β-Sn and γ-Ag<sub>2</sub>Al is parallel, leading to the similar growth direction of the whiskers. The misorientation between the whisker and the underneath grain was lower than 2°. A transitional area formed between the whisker and underneath grain, which consists of extra half-planes of atoms. A mathematical model was proposed to calculate the heterogeneous distribution of Ag atoms. By comparing the calculated growth rate with the measured growth rate of whisker, the Sn atomic transport mode was pipe diffusion.</p>
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films