Performance Measure Techniques For Wip Profile Of Semiconductor Wafer Fabrication: Models And Applications

Yf Lee,Zb Jiang,Cp Ko,Wk Tay,Lh Kang
2004-01-01
Abstract:The paper presents two approaches to develop performance measure technique for wip profile of foundry Fab. The two models are Order-Delivery-Cycle-Time (ODCT) index model of Wip profile and Equipment-Loading--Balance-Wip (ELBW) index model of Wip profile. It is useful for Wip management and determination of related production plan of wafer-start release and dispatching. With respect to the major manufacturing Wip management, quantitative measure models of Wip profile or relate indices can thus be derived. This study will be helpful for manufacturing planner to develop advanced computer aided planning and dispatching system on foundry Fab. Such study will improve manufacturing indices and serve as an inspiration for the use of new approaches and concept to determine appropriated Fab manufacturing Wip management and control system.
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