Lattice Polarity Manipulation of AlN Films on SiC Substrates for N-Polar GaN HEMTs
Yunfei Niu,Gaoqiang Deng,Tao Wang,Haotian Ma,Shixu Yang,Jiaqi Yu,Lidong Zhang,Yusen Wang,Changcai Zuo,Bin Duan,Baolin Zhang,Guoxing Li,Xiaojuan Sun,Dabing Li,Yuantao Zhang
DOI: https://doi.org/10.1021/acs.cgd.4c00585
IF: 4.01
2024-01-01
Crystal Growth & Design
Abstract:Realization of nitrogen-polar (N-polar) AlN on SiC is important for the development of high-performance GaN high-electron mobility transistors (HEMTs). However, AlN films grown on SiC substrates are mostly metal-polar, and it is difficult to achieve an N-polar AlN on them. In this work, we manipulated the lattice polarity of AlN grown on SiC by varying the V/III ratio. Our results show that AlN films grown at a low V/III ratio undergo lattice polarity reversal from N-polarity to metal-polarity near the AlN/SiC interface. This occurs because oxygen enrichment occurs in AlN, forming a thin AlON layer close to the interface. Importantly, we suppress the oxygen enrichment and thus the formation of AlON in AlN under a high V/III ratio, i.e., an N-rich growth condition, and finally achieve an N-polar AlN film on SiC. We also find that the threshold V/III ratio that realizes N-polar AlN on SiC without lattice polarity reversal is similar to 6000. Furthermore, we prepared a GaN/AlGaN HEMT structure based on the obtained N-polar AlN, and the 2-dimensional electron gas density and mobility at the heterostructure interface are 1.5 x 10(13) cm(-2) and 923 cm(2)/Vs, respectively. This work is expected to promote the development of N-polar GaN HEMTs on SiC.