Abstract:It is extremely difficult to obtain high output power with silicon based processes, which presents one of the greatest challenges for realizing fully integrated transceivers, especially at millimeter-wave frequencies. For this reason, various power combining methods have been proposed to achieve higher power levels.In this paper, a novel power combining method suitable for millimeter-wave applications is presented. The power combining network is synthesized in package utilizing wafer level packaging technology, with an array of power sources of moderate output power capability assumed to be distributed on chip, which means applying further combining in addition to existing on-chip power combining scheme for potentially even higher output power is possible.The power combining network is composed of more basic power combining units, each consisting of one substrate integrated waveguide (SIW) resonator coupling four lambda/4 standing-wave resonators, which can be synthesized using two quarter-wavelength vertical vias with one end open and the other end shorted. For power combining purpose, the open end of each lambda/4 resonator is connected to the differential output of one on-chip power source, while the shorted end is realized using one of the two metal plates of the SIW resonator. The coupling between the SIW resonator and lambda/4 resonators is through slotting on the metal plate to allow magnetic leakage so that oscillation in lambda/4 resonators will excite the SIW resonator to oscillate. As the quality factor of the SIW resonator is much larger than those of lambda/4 resonators, energy is mainly confined in the cavity of the SIW resonator so that power combing is achieved.Example design for 60 GHz application is detailed in the paper with simulation results using commercial CST software showing the effectiveness of the power combining method.

Notice of Removal: Design of Four-Way Quasi-Optical Power Combiner for High Power Millimeter Wave

Novel Millimeter-Wave Power Combining Utilizing Wafer Level Packaging Technology

A Novel Design Method for Quasi-Optical Power Combiner/Divider

A Special 3-Mirror Quasi-Optical Power Combining System

Waveguide-Based Meniscus Thin Lens For Broadband Mm-Wave Power Combining Applications

Theory and Optimization Calculation of 3-Mirror Axisymmetric Quasi-Optical Power Combining

3-Mirror Quasi-Optical Power Combining Of Millimetre-Wave Sources

Design on Waveguide Thin Lens Quasi-Optical Power Combining

Novel millimeter wave power-combining system in 3-D packaging level

Quasi-Optical Power Combining Based on Two-dimensional Meniscus Lens

A Proposal of Zero Leakage-Loss Passive Optical Combiner Based on Nonreciprocal Waveguide

Design of New Millimeter-wave Power Combiner

Propagation Characteristic Analysis and Applications of Spatial Four-Waveguide System

Multi-Way Quasi-Optical Waveguide Power Divider with 2D Diffraction Approximation and Experimental Verification at Millimeter Wave

X‐band Compact Coaxial Power Combiner for High‐power Applications

Terahertz Four-Way Out-of-phase Waveguide Power Combiner with Low Insertion Loss

A Waveguide-Based Spatial Power Combining Module at Higher Millimeter-Wave Frequency

Compact four‐way quasi‐rectangular cavity power combiner with high isolation and high power‐combining efficiency

Quasi-optical power combining using waveguide-based hyperbolic lens

Ultracompact And Wideband Power Splitter Based On Triple Photonic Crystal Waveguides Directional Coupler

Advances on Millimeter Wave Quasi-Optical Power Combining Techniques