Errors Analysis And Synthesis Of Wafer Stages Based On Rigid Body Kinematics

Q Zhao,Sz Yan,Lm Tang
2005-01-01
Abstract:Motion accuracy of wafer stage is one crucial factor to determine the critical dimension of integrated circuits in microlithography. A new error model is proposed based on rigid body kinematics. For the macrostage part of the wafer stage, a displacement measurement method is presented to calibrate the errors. By measuring the displacement errors along the 6 lines in the stage work zone, a total of 13 geometric error components in the macrostage can be determined. For the microstage part, the errors mapping relation is derived based on matrix differential method. An error synthesis approach using nonlinear optimization model is put forward based on the sensitivity analysis. Two simulation examples are carried out to illustrate the proposed approaches. The above errors model can present references to the design and analysis of wafer stages.
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