A novel shock life model for BGA solder joints based on evolutionary power spectral density

Yongbin Dang,Zhiwei Hao,Qiuhua Zhang,Yi Sun,Wei Liu

DOI: https://doi.org/10.1016/j.ijfatigue.2023.107816

IF: 5.489

2023-07-02

International Journal of Fatigue

Abstract:Multiple shock damage of Ball grid array (BGA) solder joint is one of the important reasons for space mission failure. A novel shock life model is proposed for BGA solder joints to evaluate its life under shock loads based on the evolutionary power spectral density (EPSD). Considering the bandwidth and non-Gaussian features of the stress signals during different stages, the shock stress response was treated as a non-stationary and non-Gaussian stochastic process. EPSD of the shock stress response is derived in matrix form based on wavelet transforms. The weight coefficient and non-Gaussian damage factor are proposed to describe the influence of the bandwidth and non-Gaussian characteristics of shock response on fatigue damage, respectively. The damage values of different stress stages were calculated by weight coefficient and corrected using non-Gaussian damage factor. Then the shock life model is proposed based on damage accumulation theory. Tests for the BGA solder joints shock life were conducted, and the result shows that the proposed model is feasible. Therefore, the developed method in the paper is expected to provide reference for the prediction of BGA solder joint shock life in aerospace engineering.

materials science, multidisciplinary,engineering, mechanical