Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

Chunyue Huang,Sheng-jun Zhao,Xiang-qiong Tang,Liang-kun Lu

DOI: https://doi.org/10.1109/ICEPT.2018.8480531

2018-08-01

Abstract:Based on the theory of thermal elasticity and plasticity and ANSYS software, the finite element model of residual stress after reflow soldering of lead-free peripheral array BGA solder joints was established. The reflow cooling process of Sn3.0Ag0.5Cu solder joints was simulated by using the berth and death technology. The residual stress distribution of the BGA solder joint was obtained by loading the temperature profile of the reflow cooling stage at different rates. The results show that the equivalent stress increases rapidly with the decrease of temperature during the initial stage of cooling and crystallization of solder joints. When the temperature of the solder joint gradually decreases to room temperature, the equivalent stress is the maximum; in the reflow process, the stress of BGA solder joints distribution is uneven, the maximum stress occurs at the outermost corner of the solder joint array; with the increase of the cooling rate, the residual stress increases.

Materials Science,Engineering