Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

Insights into the Nucleation, Grain Growth and Phase Transformation Behaviours of Sputtered Metastable Β-W Films

Template-induced Formation of Α-W and Size-Dependent Properties of Tungsten Thin Films

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Phase composition of sputter deposited tungsten thin films

Unravelling oxygen driven α to β phase transformation in tungsten

Phase Control and Young's Modulus of Tungsten Thin Film Prepared by Dual Ion Beam Sputtering Deposition

Microstructures and Nano Mechanical Properties of the Metal Tungsten Film

In situ observation of intergranular fracture propagation in nanocrystalline freestanding ultrathin tungsten film

Experimental and DFT characterization of interphase boundaries in titanium and the implications for ω-assisted α phase precipitation

Investigation on the Interfacial Stability of Multilayered Cu–W Films at Elevated Deposition Temperatures During Co-Sputtering

Boriding of tungsten by the powder-pack process: Phase formation, growth kinetics and enhanced neutron shielding

COHERENT GROWTH OF Α-W FILM ON Si WAFER AND ITS THICKNESS DEPENDENT MECHANICAL AND ELECTRICAL PROPERTIES

The Characterization of Superconducting Tungsten Thin Films Deposited by DC Magnetron Sputtering

Atomic-scale observation of non-classical nucleation-mediated phase transformation in a titanium alloy

Thermal Stability of Tungsten Sub-Nitride Thin Film Prepared by Reactive Magnetron Sputtering

Composition-mediated abnormal phase evolution in Ta-W films with Cr buffer layers

Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films

Role of ω phase in the formation of extremely refined intragranular α precipitates in metastable β-titanium alloys

Unraveling grain growth of metallic tungsten: Investigating the nanoscale realm of hydrogen reduction of tungsten oxides

The Surface Mapping and Crystal Orientation of Body-Centered Cubic Thin Metal Tungsten Films of Different Thickness