Electron Energy Distribution Rebuilding at the Insulator–semiconductor Interface in AC Thin Film Electroluminescent and Field Emission Display Devices

Jinghua Huang,Dejie Li
DOI: https://doi.org/10.1016/s0040-6090(02)01035-0
IF: 2.1
2003-01-01
Thin Solid Films
Abstract:Rebuilding the electron distribution at insulator–semiconductor interface in electronic devices by the addition of a metal interlayer is proposed. Electron emission from the insulator–semiconductor interface is investigated by measuring the transmission currents and threshold voltage of Mo/Ta2O5/(Metal)/ZnS/Au thin film devices when triangular voltage waveform is applied. When a metal interlayer is added, the transmission current curve does not exhibit the typical shoulders of insulator–semiconductor interface. This behavior reveals that a metal interlayer can restrict the electron energy distribution to a certain energy level. In addition, for devices with a metal interlayer, the threshold voltage for electrons to inject into the semiconductor layer decreases considerably.
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