Synthesis of Highly Antioxidant and Low-Temperature Sintering Cu-Ag Core–shell Submicro-Particles for High-Power Density Electronic Packaging

Wanchun Yang,Wei Zheng,Shaowei Hu,Mingyu Li
DOI: https://doi.org/10.1016/j.matlet.2021.129781
IF: 3
2021-01-01
Materials Letters
Abstract:The highly antioxidant Cu-Ag core-shell submicro-particles (Cu@Ag particles) were synthesized by "two steps" including replacement reaction and chemical reduction deposition. The Cu submicro-particles with fine size and dispersion were purchased as cores. Glycol was used as reaction solvent and acted as the reductant at high temperature. The results indicate that Cu@Ag particles with complete, uniform and dense Ag-shells (about 100 nm thickness) were synthesized successfully during reaction at 9 degrees C for 40 min and 150 degrees C for 20 min subsequently, with formic acid added. What's more, the nanostructure on surface of the Ag-shell made the low-temperature sintering possible. Finally, Cu-Cu joints with high shear strength of 97.86 MPa were obtained with Cu@Ag particles by pressure sintering (250 degrees C for 15 min under 10 MPa) in atmosphere. (C) 2021 Published by Elsevier B.V.
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