Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging

Yanliang Shan,Yunhui Mei,Meiyu Wang,Xin Li,Yanhong Tian,Gang Chen,Kim Shyong Siow

DOI: https://doi.org/10.1109/tcpmt.2021.3070020

2021-01-01

IEEE Transactions on Components Packaging and Manufacturing Technology

Abstract:This study experimentally investigated the whole-life ratcheting behavior of sintered copper joints with consideration of the effects of stress rate, stress amplitude, mean stress, maximum stress, and stress ratio. Deformation of joints under cyclic load was measured by a noncontact displacement detecting system. In these joints, ratcheting strain and ratcheting strain rate were found to be sensitive to loading factors. For example, strain decreased as mean stress and stress amplitude decreased, and also as stress ratio and stress rate increased. Meanwhile, larger stress amplitude or mean stress reduced ratcheting fatigue life, while increasing stress ratio and stress rate increased fatigue life. The results indicate the modified Goodman model accounting for the effects of mean stress can usefully predict the ratcheting fatigue life of sintered copper joints at room temperature.