Performance Optimization of Atomic Layer Deposited ZnO Thin-Film Transistors by Vacuum Annealing

Mengfei Wang,Dan Zhan,Xin Wang,Qianlan Hu,Chengru Gu,Xuefei Li,Yanqing Wu
DOI: https://doi.org/10.1109/led.2021.3068992
IF: 4.8157
2021-01-01
IEEE Electron Device Letters
Abstract:In this letter, high-performance zinc oxide thin-film transistors (ZnO TFTs) have been fabricated on Si substrate by atomic layer deposition (ALD) at 190 °C. The field-effect mobility ( $\mu _{FE}$ ) can be improved from 18.5 cm2/ $\text{V}\cdot \text{s}$ to a record high 43.2 cm2/ $\text{V}\cdot \text{s}$ while maintaining a large $\text{I}_{{\mathrm {on}}}/\text{I}_{{\mathrm {off}}}$ ratio of $5\times 10^{9}$ after rapid thermal annealing (RTA) under vacuum at 350 °C. The excellent performance can be attributed to the improvement in the ZnO channel and the interface. The oxygen vacancy ratio in ZnO increases from 36.2% to 40.0%. The interface trap density ( $\text{N}_{it}$ ) between silicon oxide (SiO2) and ZnO decreases from $5.1 \times 10^{11}$ eV $^{-1}$ cm $^{-2}$ to $1.4\times 10^{11}$ eV $^{-1}$ cm $^{-2}$ . Furthermore, the oxide trap density ( $\text{N}_{{\mathrm {ot}}}$ ) of the SiO2 dielectric reduces from $3.7\times 10^{19}$ eV $^{-1}$ cm $^{-3}$ to $1.1\times 10^{19}$ eV $^{-1}$ cm $^{-3}$ . Finally, we systematically study the electrical performance of the annealed ZnO device at measurement temperature from room temperature of 20 °C to a much higher temperature of 180 °C without device failure.
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