Synergistic Reinforcement of Cu–Ni–Al Films with Dual Nanostructure

Z. M. Li,X. N. Li,X. T. Cheng,Y. L. Hu,Y. H. Zheng,M. Yang,C. Dong
DOI: https://doi.org/10.1080/02670844.2020.1815492
IF: 2.451
2021-01-01
Surface Engineering
Abstract:Nanocrystalline-strengthened surface layer significantly improves the surface hardness and wear resistance of Cu or Cu alloys and avoids the reduction of conductivity. However, the poor thermal stability limits its industrial application. Herein, a series of Cu-Ni-Al films were prepared by radio frequency magnetron sputtering, which shows gamma (similar to 20 nm) + gamma ' GREEK TONOS phase (similar to 10 nm) dual nanostructure. Compared with pure Cu film, gamma ' phase precipitation-strengthened films possess higher hardness, outstanding wear resistance and a certain electrical conductivity. The strengthening mechanisms have been discussed in detail. After annealing at 450 degrees C/20 h, the hardness of Cu-Ni-Al films decreases slightly, but their wear resistance remains essentially unchanged, exhibiting superior thermal stability, the main reason of which is that the growth of nanocrystalline Cu can be retarded through the precipitation of gamma ' phases.
What problem does this paper attempt to address?