Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening

Yang Zhou,Junlan Wang

DOI: https://doi.org/10.3390/met14030256

IF: 2.695

2024-02-21

Metals

Abstract:In this study, Cu/Ni and Cu/Al multilayers, with individual layer thickness varying from 25 nm to 200 nm, and co-sputtered Cu-Ni and Cu-Al single layer films were deposited at room temperature via magnetron sputtering and further annealed from 100 °C to 300 °C. The mechanical and microstructural properties of the as-deposited and annealed samples were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both multilayer systems exhibit an increase in hardness with increasing annealing temperature. However, the Cu/Ni system shows a gradual and moderate hardness increase (up to 30%) from room temperature to 300 °C, while the Cu/Al system displays a sharp hardness surge (~150%) between 125 °C and 200 °C. The co-sputtered Cu-Ni and Cu-Al samples consistently demonstrate higher hardness than their multilayered counterparts, albeit with distinctly different temperature dependence—the hardness of Cu-Ni increases with annealing temperature while Cu-Al maintains a constant high hardness throughout the entire temperature range. The distinct thermal strengthening mechanisms observed in the two metallic multilayer systems can be ascribed to the formation of solid solutions in Cu/Ni and the precipitation of intermetallic phases in Cu/Al. This study highlights the unique advantage of intermetallic strengthening in metallic multilayer systems.

materials science, multidisciplinary,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

The paper primarily explores the impact of heat treatment on the mechanical properties of Cu/Ni and Cu/Al multilayer thin film materials, particularly the differences between solid solution strengthening and intermetallic compound strengthening.

The study prepared Cu/Ni and Cu/Al multilayer thin films of different thicknesses (ranging from 25 nm to 200 nm) using magnetron sputtering technology, deposited at room temperature, and subsequently heat-treated at different temperatures ranging from 100°C to 300°C. The mechanical properties and microstructural changes of these thin film materials were investigated using nanoindentation, X-ray diffraction (XRD), and scanning electron microscopy (SEM).

For the Cu/Ni system, as the heat treatment temperature increased, the hardness gradually increased, but the increase was relatively moderate (up to 30%). In contrast, the hardness of the Cu/Al system significantly increased (about 150%) within a narrower temperature range of 125°C to 200°C, showing the strengthening effect of intermetallic compound formation.

Additionally, the study compared the performance of co-sputtered Cu-Ni and Cu-Al single-layer films. The hardness of these samples was generally higher than that of the corresponding multilayer films, maintaining a high level across the entire temperature range. Among them, the hardness of the Cu-Ni single-layer film increased with the rise in heat treatment temperature, while the Cu-Al single-layer film maintained a constant high hardness throughout the temperature range.

In summary, this paper aims to reveal the unique strengthening mechanisms of Cu/Ni and Cu/Al multilayer thin film materials during the heat treatment process, particularly the advantages of intermetallic compound strengthening over solid solution strengthening. This is of great significance for the development of high-performance multilayer thin film materials.