Abstract:Two classes of curing agents that enable polymers to exhibit balanced thermal and insulation properties with functional bridging groups. There is a weak conjugation system in highly thermally stable epoxy with aromatic backbone, using electron‐modulating bridging groups to immobilize intramolecular charges by tailoring trap sites, and bulky bridging groups to prevent molecular stacking to inhibit intermolecular charge transport. The escalating demand for high‐power and compact‐size advanced electronic devices and power systems necessitates polymers to exhibit superior electrical properties even under harsh environments. However, reconciling the seemingly contradictory attributes of excellent electrical properties and thermal stability poses a formidable challenge for current epoxy polymer (EP) materials and their applications. To meet the need, here two classes of bi‐aryl diamine curing agents are described that enable polymers to exhibit well‐balanced thermal and dielectric properties with functional bridging groups. A weak conjugation system in highly thermally stable polymers with an aromatic backbone is constructed, using electron‐modulating bridging groups to immobilize intramolecular free carriers by tailoring trap sites, and bulky bridging groups to prevent molecular stacking to inhibit intermolecular charge transport. The resultant polymer exhibits a volume resistance of 7.45 × 1012 Ω m and a direct current breakdown strength of 368.74 kV mm−1 at 120 °C, which are 2.2 and 2.4 times higher than that of commercial anhydride‐cured EP, respectively. It is demonstrated to be due to the inhibition of charge injection and transport. The proposed aromatic amine multimolecule approach, combined with diverse functional bridging groups, is a promising direction for exploring next‐generation EP insulation materials suitable for extreme conditions.

Research Progress on Modification of Epoxy Resin Materials for High-Voltage Electrical Equipment

Research Progress on Modification of Epoxy Resin

Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

Research on the Vacuum Casting Epoxy Insulating Materials of High Voltage Cable Accessory

Strengthening and Toughening Technology of Epoxy Resin

Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging

Research Progress of Epoxy Resin Toughening Method and Toughening Agent

Molecular dynamics study on the influence of thermal aging on the mechanical properties of epoxy resins for high voltage bushing

Research on modified epoxy resin for electronic mold encapsulation with toughness and flame retardance

Research and Application Progress of Resin-Based Composite Materials in the Electrical Insulation Field

Study on the Influence of Cross-linked Network Modifiers on the Dielectric Properties of Epoxy Resin

Current Status of Research on the Modification of Thermal Properties of Epoxy Resin-Based Syntactic Foam Insulation Materials

Research progress on high-temperature properties of carbon fiber reinforced polymer composites for cables

Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: A mini-review

Enhanced Anticarbonization and Electrical Performance of Epoxy Resin via Densified Spherical Boron Nitride Networks

Preparation and characteristics of silicone-modified aging-resistant epoxy resin insulation material

Research development on the toughness and performance of epoxy resin-based composites in low-temperature environments

Research Progress in High-Temperature-Resistant Electromagnetic Wire

Surface Charge Properties of Epoxy Composites under DC Voltage Affected by Surface and Bulk Conductivity

Revolutionizing High‐Temperature Electrical Properties of Epoxy Resin via Tailoring Weak Conjugation Rigid Structures

Study on mechanical and thermal properties of a modified epoxy resin