Research on modified epoxy resin for electronic mold encapsulation with toughness and flame retardance

GE Jian-fang,ZHANG Ya-ping,LIANG Shi-qiang,LI Zhen-hua
DOI: https://doi.org/10.3969/j.issn.1004-2849.2006.03.002
2006-01-01
Abstract:This modified epoxy resin which is characteristic of toughness and flame retardance was prepared. Flexible epoxy resin,activated toughening agent,phosphate flame retardant FR -P and complex flame retardant FR-A are used to modify the epoxy resin, which obtained the performance of self-extinguishing and toughness. It will be satisfied for dealing with the problems of epoxy resin for electrical engineering.
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