Effect of rare earth on microstructure and solderability of Sn-0.7Cu-0.075Al lead-free solder

Zai-xiang DU,Cai-ju CHEN,Chao-qun WANG,Feng-ling XIE,Ai-hua YU,Wen-chao YANG,Yong-zhong ZHAN

DOI: https://doi.org/10.13624/j.cnki.issn.1001-7445.2017.0627

2017-01-01

Abstract:In order to solve the immiscible problem of Sn-Al system,a series of Sn-Cu-Al lead-free solders added with rare earth were prepared by powder pressing and vacuum arc melting,and the effects of the single rare earth Ce,La and the mixed rare earths on the microstructure and solderability properties of solders were studied.The results showed that the addition of different rare earths could refine and uniform the microstructure of the solders.Moreover,the single rare earths Ce or La performed better than the mixed rare earth.The single rare earths Ce or La reduced the melting point of the matrix alloy from 229.82 ℃ to 227.06 ℃ and 227.38 ℃ respectively,while the mixed rare earths affected little. However,the melting range was slightly reduced benefited from the rare earth addition. All kinds of rare earth improved the weldability of the matrix alloy with the single rare earth Ce increased the most, changing the spreading rate and the wetting angle of the matrix alloy from 68.61% to 73.88%, 34.6 degrees to 26.6 degrees respectively.