Selective preparation of metal copper layer on silicate glass by laser surface modification

Tianjiang HOU,Jun AI,Jianguo LIU,Xiaoyan ZENG
DOI: https://doi.org/10.7510/jgjs.issn.1001-3806.2018.02.007
2018-01-01
Abstract:In order to realize the metallization of ordinary silicate glass surface,roughness and activation were carried out by pulse ultraviolet (355nm wavelength) laser etching. The conductive copper layer was locally fabricated on the surface with the combination of chemical plating. The influence of laser processing parameters on micro topography,roughness and etching depth of glass surface was investigated. Palladium was successfully introduced into glass surface. The results show that, at the first scanning (UV laser scanning rate of 200mm/s, pulse frequency of 100kHz, energy density of 27J/cm2~37J/cm2and filling interval of about 10μm),the etched depth of glass surface is between 25μm~35μm and roughness Raof the etching region is between 6μm~7μm. Glass won't crack at this time. At the second scanning (energy density between 9J/cm2~11J/cm2and the remaining unchanged parameters),chemical copper plating was realized by the introduction of palladium. At this point,the average bonding strength between copper layer and glass can be above 10MPa and volume resistivity of copper layer can reach 10 -6Ω·cm orders of magnitude. The glass surface metallization process is with local selectivity, no needed mask, low cost, high bonding strength and good electrical conductivity.
What problem does this paper attempt to address?