thermal conductivity of high thermal conductivity composites for electronic packaging

吉元,钟涛兴,高晓霞,毋立芳,陈皓明,王秀凤,韩立,谢志刚

DOI: https://doi.org/10.3969/j.issn.1000-6281.2001.03.013

2001-01-01

Abstract:Scanning thermal microscopic analysis of interface thermal conductivity of high thermal conductivity composites for electronic packaging

What problem does this paper attempt to address?

Fabrication of Three-dimensional Thermally Conductive Carbon Fibers/Carbon Nanotubes Network Reinforce Epoxy Composites

Shuai Cao,Tao Jiang,Shanshan Shi,Xiaofan Gui,Ying Wang,Bo Tang,Lixue Xiang,Xuming Dai,Donghai Lin,Ning Zhong,Wenge Li,Jinhong Yu,Xinfeng Wu

DOI: https://doi.org/10.1016/j.coco.2024.102205

IF: 8

2024-01-01

Composites Communications

Abstract:With the rapid development of electronic devices and digital communication, the problem of overheating emerges due to high integration, high power and high frequency. At present, it is a hot spot to construct three-dimensional thermal conductive carbon networks for heat dissipation of electronic devices. In this paper, the Epoxy/carbon fibers/carbon nanotubes (Epoxy/CFs/CNTs) composite with high thermal conductivity was manufactured by vacuum-assisted filtration and hot press method. The effects of the carbon nanotubes content on the thermal conductivity of composites were investigated. The mutual lapped CNTs and CFs formed a thermal conductive skeleton, which obviously improves the thermal performance of the composites. The results reveal that the in-plane thermal conductivity of the Epoxy/CFs/CNTs-50c composite (17.60 vol% CFs and 8.42 vol% CNTs) reaches 20.55 W/mK, about 108 times of the thermal conductivity of the Epoxy (0.19 W/mK). In addition, Epoxy/CFs/CNTs-50c has favorable thermal management properties and achieved excellent results in LED tests. The Epoxy/CFs/CNTs composites have excellent thermal conductivity and have enormous potential as advanced thermal management materials.
Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging

Yuan Ji,TaoXing Zhong,Xiaoxia Gao,Dong Luo,Huier Li,Haoming Chen,Xiufeng Wang,Li Han

DOI: https://doi.org/10.1081/TMA-100105052

2007-01-01

Journal of Trace and Microprobe Techniques

Abstract:The metal matrix composite as a novel electronic packaging offers a high thermal conductivity. The thermal property of interfaces of SiC/Cu, SiC/Al and NiAl/Al composites have been comparatively evaluated by the thermal imaging of scanning thermal microscope (SThM) with micron-sized spatial resolution. The relative values of interface thermal conductivity have been obtained by processing and calculating SThM topographic and thermal data.
Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Ying Wang,Yuan Gao,Bo Tang,Xinfeng Wu,Jin Chen,Liming Shan,Kai Sun,Yuantao Zhao,Ke Yang,Jinhong Yu,Wenge Li

DOI: https://doi.org/10.1039/d1ra04602k

IF: 4.036

2021-01-01

RSC Advances

Abstract:As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which is the main factor that limits the operating speed and service lifetime of electronic devices.

chemistry, multidisciplinary
Phase change composites with ultra-high through-plane thermal conductivity achieved by vertically-aligned graphite film and double-shelled microcapsules

Lei Kang,Hongyu Niu,Liucheng Ren,Ruicong Lv,Shulin Bai

DOI: https://doi.org/10.1016/j.compositesa.2024.108162

IF: 9.463

2024-03-22

Composites Part A Applied Science and Manufacturing

Abstract:The heat dissipation in electronic devices has become bottleneck problem. One of the best solutions is to develop high performance materials which can not only dissipate the heat away, but also absorb heat energy. This kind of double function materials can be obtained by simultaneously using high thermal conductivity (TC) materials and phase change materials. The formation of continuous network of thermally conductive fillers is demonstrated as one of the most effective methods for fabricating highly thermally conductive composites. Here, graphite films (GF) are stacked and vertically cut to endow the composites with high through-plane TC. The obtained composites exhibit a through-plane TC of 51.55 W m −1 K −1 and a low thermal resistance of 0.398 °C cm 2 W −1 . Besides, double-shelled PDA@SiO 2 @paraffin (Pa) microcapsules are embedded into the composite to give its good heat-absorption capacity. Via a CPU thermal stress test, the composites demonstrate satisfactory temperature controlling performance.

materials science, composites,engineering, manufacturing
Enhanced in-plane thermal conductivity of polyimide-based composites via in situ interfacial modification of graphene

Huiya Lan,Bin Wu,Yuye Yan,Ru Xia,Jiasheng Qian

DOI: https://doi.org/10.1039/d2nr06573h

IF: 6.7

2023-02-23

Nanoscale

Abstract:Interfacial thermal resistance is the main barrier restricting the heat dissipation of thermal management materials in electronic equipment. The interface structure formed by covalent bonding is an effective way to promote interfacial heat transfer. Herein, an integrated composite with multi-aspect covalent bonding beneficial for heat transmission is constructed by polyimide (PI) polymerization with maleimide modified graphene nanosheets (M@GNS). The interfacial structure with low thermal resistance built by covalent bonding and oriented graphene arrangement initiated by the coating process makes the in-plane thermal conductivity of the composite as high as 16.10 W m-1 K-1. Finite element simulation and 1000 bending tests are carried out to further verify the performance advantages of the integrated structure in the internal thermal diffusion and long-term use of the composite. M@GNS/PI with integrated structure provides extra heat transfer channels for heat dissipation, possibly providing an effective way to address the traditional thermal accumulation issue of electronic devices.
Recent advances in 3D interconnected carbon/metal high thermal conductivity composites

Hong-Da Guan,Xin-Bo He,Zi-Jian Zhang,Tao Zhang,Xuan-Hui Qu

DOI: https://doi.org/10.1016/s1872-5805(23)60774-7

IF: 5.7

2023-10-29

New Carbon Materials

Abstract:As the temperature of electronic devices continues to rise, the quest for high-efficiency heat dissipation has emerged as a critical concern, particularly when it comes to ensuring device performance and longevity. A high thermal conductivity is usually dependent on the ability of fillers to provide thermal conduction channels within composites. In recent years, the development of three-dimensional (3D) interconnected structures using high thermal conductivity fillers in composites has emerged as a promising approach. Compared to the traditional isotropic distribution and directional arrangements, 3D interconnected filler structures improve the thermal conductivity. We review research progress on metal matrix composites with a 3D interconnected carbon filler that have a high thermal conductivity. The thermal conductivity mechanisms and models of composites are elaborated, and important factors relevant to improving the thermal conductivity are considered. Ways of constructing 3D interconnected carbon networks and their effects on the thermal conductivity of their composites should serve as a reference for the advancement of high-performance metal matrix thermal conductivity composites.

materials science, multidisciplinary
Development and Perspectives of Thermal Conductive Polymer Composites

Jiaqi Wang,Lin Hu,Wenhao Li,Yuge Ouyang,Liuyang Bai

DOI: https://doi.org/10.3390/nano12203574

IF: 5.3

2022-10-12

Nanomaterials

Abstract:With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

Dingkong Liu,Jinxing Zhao,Yueyang Ning,Hongbing Ma,Bo Wang,Yunxiang Lu,Wei Li,Linhong Li,Wen Dai,Cheng-Te Lin,Nan Jiang,Chen Xue,Jinhong Yu

DOI: https://doi.org/10.1016/j.coco.2021.100704

IF: 8

2021-06-01

Composites Communications

Abstract:Heat sink materials with superior thermal conductivity and excellent mechanical strength with low cost, are desirable for electronic packaging and thermal management in electronic and electrical engineering systems. In this work, the graphene paper (GP)/copper (Cu) composites were prepared by using a vacuum hot pressing. A zebra skin structure was constructed for improving the thermal transportation performance of GP/Cu composites. In virtue to its unique zebra skin structure, the ultrahigh thermal conductivity of 968 W m-1 K-1 was achieved for the GP/Cu composite at 70 vol% graphene loading. Furthermore, the GP/Cu composite retains high flexural strength (88 MPa) due to the good interface compatibility between the surface chemical treated GP and Cu paper. Our work provides a new method to significantly improve the in-plane thermal conductivity of thermal management materials.

materials science, composites
Epoxy composite with metal-level thermal conductivity achieved by synergistic effect inspired by lamian noodles

Maohua Li,Linhong Li,Yapeng Chen,Yue Qin,Xianzhe Wei,Xiangdong Kong,Zhenbang Zhang,Shaoyang Xiong,Hainam Do,James C. Greer,Zhongbin Pan,Xiaoxue Shui,Tao Cai,Wen Dai,Kazuhito Nishimura,Cheng-Te Lin,Nan Jiang,Jinhong Yu

DOI: https://doi.org/10.1016/j.compscitech.2022.109677

IF: 9.1

2022-09-29

Composites Science and Technology

Abstract:To enhance thermal dissipation from packaged electronic components, a material with high thermal conductivity and low coefficient thermal expansion is required. In this work, a strategy inspired by the processing of lamian, a type of traditional Chinese noodle, is proposed. By combining two important methods, aligning filler and bridging effect, the method can construct composites with both high thermal conductivity and coefficient thermal expansion. The epoxy composite exhibits a high thermal conductivity of 110 W m−1 K−1 and a low coefficient of thermal expansion of 7.4 ppm K−1, which can be compared to the value for metals. On the other hand, the material's density is comparable to that of polymers and is consequently much lower than that of typical metals. Considering these advantageous properties, it is anticipated that these composites can play a leading role in the development of new, low cost packaging materials.

materials science, composites
Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

R. Li,X. Yang,J. Li,Y. Shen,L. Zhang,R. Lu,C. Wang,X. Zheng,H. Chen,T. Zhang

DOI: https://doi.org/10.1016/j.mtphys.2021.100594

IF: 11.021

2022-01-01

Materials Today Physics

Abstract:Polymers are widely used in electronic packaging due to their easy processing, lightweight, excellent insulation, and good mechanical properties. However, as electronic devices gradually turn towards high energy density and low signal delay, polymers with high thermal conductivity and low dielectric properties are in large demand. Since polymers have low intrinsic thermal conductivity, thermally conductive fillers need to be added when preparing polymer composites. However, there is always a trade-off between the thermal conductivity and the dielectric properties in polymer composites, which is significant for researchers to understand. Therefore, for the first time, this review elaborates how to balance the high thermal conductivity and the low dielectric properties. Recent progress of thermally conductive fillers is summarized, aiming to provide a reference for applying polymer composites in the field of microelectronics. Also, the challenges and the outlooks of polymers with high thermal conductivity and low dielectric properties are outlined.

materials science, multidisciplinary,physics, applied
High thermal conductive copper/diamond composites: state of the art

S. Q. Jia,F. Yang

DOI: https://doi.org/10.1007/s10853-020-05443-3

IF: 4.5

2020-10-20

Journal of Materials Science

Abstract:Abstract Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

materials science, multidisciplinary
Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

Ying Wang,Bo Tang,Yuan Gao,Xinfeng Wu,Jin Chen,Liming Shan,Kai Sun,Yuantao Zhao,Ke Yang,Jinhong Yu,Wenge Li

DOI: https://doi.org/10.1021/acsomega.1c02694

IF: 4.1

2021-07-15

ACS Omega

Abstract:Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones). Therefore, the research on improving the thermal conductivity of materials has a very important theoretical value and a practical application value. Whether the thermally conductive filler in polymer composites can form a highly thermal conductive pathway is a key issue at this stage. The carbon fiber/carbon felt (CF/C felt) prepared in the study has a three-dimensional continuous network structure. The nickel-coated carbon fiber/carbon felt (CF/C/Ni felt) was fabricated by an electroplating deposition method. Three-dimensional CF/C/Ni/epoxy composites were manufactured by vacuum-assisted liquid-phase impregnation. By forming connection points between the adjacent carbon fibers, the thermal conduction path inside the felt can be improved so as to improve the thermal conductivity of the CF/C/Ni/epoxy composite. The thermal conductivity of the CF/C/Ni/epoxy composite (in-plane K∥) is up to 2.13 W/(m K) with 14.0 wt % CF/C and 3.70 wt % Ni particles (60 min electroplating deposition). This paper provides a theoretical basis for the development of high thermal conductivity and high-performance composite materials urgently needed in industrial production and high-tech fields.This article has not yet been cited by other publications.

chemistry, multidisciplinary
SCF-NiFe2O4/epoxy composites with high thermal conductivity and electromagnetic interference resistance

Houbao Liu,Renli Fu,Xinqing Su,He Wang,Binyong Wu,Qinjiang He

DOI: https://doi.org/10.1007/s10854-020-04644-5

2020-10-20

Abstract:With the development of electronic components towards high power, high packaging density, and miniaturization of device size, heat dissipation and the electromagnetic interference problems between the electronic components are emerging. In order to solve the undesirable electromagnetic wave and heat emissions produced by electronic device simultaneously, the electronic packaging materials with high thermal conductivity and anti-electromagnetic interference are highly expected. In this work, NiFe2O4-modified short carbon fibers (SCF) were designed and prepared. NiFe2O4 were in situ grown on the surface of SCF by hydrothermal method. The chemical structure and morphology of SCF-NiFe2O4 were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The microwave absorbing performance test shows that SCF-NiFe2O4 possess superior microwave absorbing performance, where the minimum reflection loss is − 20.7 dB. Finally, SCF-NiFe2O4/epoxy resin composites were prepared by introducing SCF-NiFe2O4 as thermal conductive filler into epoxy resin. The surface-modified SCF with NiFe2O4 is more easily infiltrated by resin and exhibits strong interfacial interaction with the matrix. With the increase of the content of SCF-NiFe2O4, the thermal conductivity of the composites increases obviously. When the content of SCF-NiFe2O4 reaches 20 vol%, the composites show better thermal conductivity, and the thermal conductivity reaches 1.03 W/m K.
Advances on thermal conductive epoxy‐based composites as electronic packaging underfill materials – A review

Yingfeng Wen,Chao Chen,Yunsheng Ye,Zhigang Xue,Hongyuan Liu,Xingping Zhou,Yun Zhang,Dequn Li,Xiaolin Xie,Yiu‐Wing Mai

DOI: https://doi.org/10.1002/adma.202201023

IF: 29.4

2022-05-19

Advanced Materials

Abstract:The integrated circuits (ICs) industry has been continuously producing micro‐electronic components with ever higher integration level, packaging density and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy‐based underfills are often employed in flip‐chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next‐generation IC chips with much higher power density. Despite many strategies have been proposed to improve the thermal conductivity of epoxy, its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal‐electrical‐mechanical‐processing properties of underfill materials for flip‐chip packaging remains a great challenge. Herein, we review state‐of‐the‐art advances that have been made to satisfy the key requirements of capillary underfill materials. Based on these studies, we provide the perspectives for designing high‐performance underfill materials with novel microstructures in electronic packaging for high‐power density electronic devices. This article is protected by copyright. All rights reserved

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Ultrahigh thermal conductivity copper/graphite membrane composites prepared by tape casting with hot-pressing sintering

Qianyue Cui,Chengwei Yu,Junjie Hao,Cunguang Chen,Xiaodong Zhang,Zhimeng Guo,Alex A. Volinsky

DOI: https://doi.org/10.1016/j.matlet.2018.08.015

IF: 3

2018-01-01

Materials Letters

Abstract:•Cu/graphite membrane composite for thermal management is obtained.•Composite thermal conductivity is ultrahigh at 1005 W·m−1 K−1.•Composite properties with packed laminate structure are anisotropic.•Experiment and model fitting analysis of thermal conductivity are adopted.
Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Biao Feng,Yu-Hong Zhang,Jing Tu,Li-Wu Fan,Zi-Tao Yu

DOI: https://doi.org/10.1016/j.csite.2022.101979

IF: 6.268

2022-05-01

Case Studies in Thermal Engineering

Abstract:Sub-millimeter thick phase change material (PCM) composites have been utilized in the thermal management of micro-electronics serving as a novel thermal interfacial material. However, there is a lack of appropriate measuring methods and precise data for the thin-film PCM composites' intrinsic thermal conductivity, as well as the thermal contact resistance (TCR) at interfaces between those thin-films and metal. In this work, the out-of-plane thermal conductivity of thin-film PCM35, which is a paraffin composite showing the melting point of 35 °C, was first gauged through the commercialized transient plane source (TPS) method, followed by a correction process to deduct the TCR between thin films/temperature sensor interfaces. The direct TPS readings were corrected based on the proportional relation between samples' thickness and inherent thermal resistance. An improved steady-state heat flow apparatus designed for thin-walled samples was then utilized to examine the reliability of the corrected TPS technique, with a relative deviation between them being only ∼7%. In order to test the applicability of the corrected TPS method, the thermal conductivities of thin polytetrafluoroethylene films were also determined. Furthermore, the TCR between thin PCM35 film and thin 1060Al plate was identified by performing the improved steady-state apparatus. The contribution of overheated PCM35 film on fitting the interfacial voids and reducing the TCR were elucidated, which can guide the thermal design with the use of such thin-film PCMs.
Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Rui Zhao,Weikai Li,Tian Wang,Ke Zhan,Zheng Yang,Ya Yan,Bin Zhao,Junhe Yang

DOI: https://doi.org/10.1007/s11706-020-0503-y

2020-05-15

Frontiers of Materials Science

Abstract:Effective thermal management of electronic integrated devices with high powder density has become a serious issue, which requires materials with high thermal conductivity (TC). In order to solve the problem of weak bonding between graphite and Cu, a novel Cu/graphite film/Cu sandwich composite (Cu/GF/Cu composite) with ultrahigh TC was fabricated by electro-deposition. The micro-riveting structure was introduced to enhance the bonding strength between graphite film and deposited Cu layers by preparing a rectangular array of micro-holes on the graphite film before electro-deposition. TC and mechanical properties of the composites with different graphite volume fractions and current densities were investigated. The results showed that the TC enhancement generated by the micro-riveting structure for Cu/GF/Cu composites at low graphite content was more effective than that at high graphite content, and the strong texture orientation of deposited Cu resulted in high TC. Under the optimizing preparing condition, the highest in-plane TC reached 824.3 W·m−1K−1, while the ultimate tensile strength of this composite was about four times higher than that of the graphite film.

materials science, multidisciplinary
Improving electromagnetic engineering of thermal conductive composites by establishing continuous thermal conductive networks with gradient impedance

Dong An,Hongfeng Chen,Huitao Yu,Jiaqi Chen,Junru Yao,Chingping Wong,Wei Feng

DOI: https://doi.org/10.1039/d4tc03974b

IF: 6.4

2024-11-01

Journal of Materials Chemistry C

Abstract:Driven by the increasing integration and higher power requirements of electronics, the polymer-based composites with the high-performance of thermal conductivity (TC) and electromagnetic (EM) wave absorption have become an important issue. Herein, a multi-layer boron nitride-carbon nanotubes/carboxymethyl cellulose/polydimethylsiloxane (BN-CNTs/CMC/P DMS) composites with enhanced interface interactions, continuous thermal pathways and gradient impedance were manufactured through a strategy involving chemical surface modification, directional freeze casting, freeze drying and matrix infiltration. Benefiting from the covalent bonded effect between fillers and the consecutive thermal conductive pathways, the obtained composites achieved a maximum through-plane TC of 3.56 W/(m·K) at a filler content of only 8 wt%. Meanwhile, the composites also achieved an ultra-wide effective electromagnetic wave absorption bandwidth (EMB) of 13.45 GHz, which was attributed to the precisely controllable electromagnetic parameters and the gradient impedance structure. Therefore, these results fully indicated that the composites owned the great application potential as packaging materials for the advanced electronics.

materials science, multidisciplinary,physics, applied
Dielectric Composite Material with Enhanced Thermal Conductivity Used for Electronic Packaging

Hui Yu,Liangliang Li,Teruo Kido,Guannan Xi

DOI: https://doi.org/10.1109/icept.2010.5582424

2010-01-01

Abstract:The current trend in the integration and miniaturization of high-power electronic components requires a dielectric material with high thermal conductivity, which can conduct fast heat dissipation to prevent the circuit and substrate from overheating. Adding ceramic powders with a high thermal conductivity into the polymer is an effective way to enhance the thermal conductivity of the dielectric material. In our research, Halogen-free bisphenol-A epoxy and aluminum nitride (AlN) were chosen as the matrix and filler, respectively. The impact of AlN content on the thermal and insulating properties of the composites were investigated. A high thermal conductivity of 2.10 W/(m.K) was achieved with an AlN content of 55.9 % and a dielectric strength of 10-11 kV/mm was obtained. The viscosity of pre-curing suspension was also measured and the experimental data showed that the viscosity dramatically increased at an AlN content of 40%.
Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

Zhou Lijun,Wei Song,Guo Jingdong,Sun Fangyuan,Wang Xinwei,Tang Dawei

DOI: https://doi.org/10.11900/0412.1961.2021.00216

IF: 1.797

2022-01-01

ACTA METALLURGICA SINICA

Abstract:An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser timedomain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu6Sn5 and Cu3Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu6Sn5 was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu6Sn5 and Cu3Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu6Sn5 and Cu3Sn were 47.4 and 87.6 W/(m center dot K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu6Sn5 and Cu3Sn was examined. The test errors of the Cu6Sn5 and Cu3Sn thermal conductivity were -6.8%similar to 4.6% and -7.1%similar to 4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components.

thermal conductivity of high thermal conductivity composites for electronic packaging

Fabrication of Three-dimensional Thermally Conductive Carbon Fibers/Carbon Nanotubes Network Reinforce Epoxy Composites

Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging

Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Phase change composites with ultra-high through-plane thermal conductivity achieved by vertically-aligned graphite film and double-shelled microcapsules

Enhanced in-plane thermal conductivity of polyimide-based composites via in situ interfacial modification of graphene

Recent advances in 3D interconnected carbon/metal high thermal conductivity composites

Development and Perspectives of Thermal Conductive Polymer Composites

Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

Epoxy composite with metal-level thermal conductivity achieved by synergistic effect inspired by lamian noodles

Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

High thermal conductive copper/diamond composites: state of the art

Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

SCF-NiFe2O4/epoxy composites with high thermal conductivity and electromagnetic interference resistance

Advances on thermal conductive epoxy‐based composites as electronic packaging underfill materials – A review

Ultrahigh thermal conductivity copper/graphite membrane composites prepared by tape casting with hot-pressing sintering

Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Improving electromagnetic engineering of thermal conductive composites by establishing continuous thermal conductive networks with gradient impedance

Dielectric Composite Material with Enhanced Thermal Conductivity Used for Electronic Packaging

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System