Hierarchically Encapsulated Phase-Change Film with Multi-stage Heat Management Properties and Conformable Self-Interfacing Contacts for Enhanced Interface Heat Dissipation
Xiang Wang,Hong-wei Zhao,Xun-rui Wang,Jia-qing Zhao,Tao Wang,Chao Liang,Wayne Qiang Xu,Lu Qing,Haoran Kong,Jinhong Li
DOI: https://doi.org/10.1039/d2ta05582a
IF: 11.9
2022-10-18
Journal of Materials Chemistry A
Abstract:With the rapid evolution of power and packing densities of microelectronic and energy storage devices, timely heat dissipation towards instantaneous high intensity heat flow is becoming increasingly significant to maintain system reliability. Highly thermal conductive solid-liquid phase change film can be potential candidate for the next-generation heat dissipation material by coupling the efficient heat storage and self-softening properties during its isothermal phase transition process. Herein, a porous phase change film composed of high enthalpy paraffin microcapsules (213.7 J/g), impregnated with n-docosane and nano-Si3N4 mixture, is shown to be an ideal phase change thermal interface material (PhC-TIM). The hierarchical encapsulated structures, with two-stage thermal management properties, guarantee temperature control of electronic devices by storage of instantaneous excessive heat, without degradation of thermal conductivity (3.8 W m-1 K-1) after 500 heating-cooling cycles. Furthermore, the presented PhC-TIM demonstrates ultra-flexibility at working state, which can form tight interface contact and results low thermal contact resistance. The hot-spot temperatures of a LED chip and a lithium-ion battery module equipped with HEPCF were decreased by 15 °C and 20 °C, respectively. The obtained results open up opportunities for PhC-TIM as efficient thermal dissipation materials for electronics cooling and suppresses thermal runaway in energy storage devices.
materials science, multidisciplinary,chemistry, physical,energy & fuels