Electrochemical corrosion behavior of copper in plating solution

Zhihua Tao,Wei He,Shouxu Wang,Guoyun Zhou,Dingjun Xiao,Ze Tan
DOI: https://doi.org/10.3969/j.issn.2095-2783.2015.12.007
2015-01-01
Abstract:Copper is the key material for electrical interconnection of electronic components.However,copper corrosion for metal copper can occur under the influence of electronic plating acidic environment,which can cause early failure of the entire electronic equipment.The corrosion electrochemical behavior of copper in plating solution was investigated using polarization curves and electrochemical impedance spectroscopy (EIS).The results show that the inhibition performance of cyproconazole depends on the concentration of the inhibitor and the highest inhibition efficiency of cyproconazole reaches 99% at 1×10-3 mol/L in the base e-lectrolyte.The potentiodynamic polarization curves of copper in the base electrolyte clearly reveal that both cathodic and anodic processes of copper corrosion are suppressed,indicating cyproconazole is a type of mixed inhibitor.The resistance value of copper concentration increases with cyproconazole increase.Adsorption of inhibitor on the copper surface in the base electrolyte follows the Langmuir isotherm model.
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