Effect of cooling conditions after homogenization on the microstructure and performance of an Al-Cu alloy

Jiaojiao LIU,Yu HAN,Zhixiang ZHU,Baoan CHEN,Hongyu ZHANG,Hongying LI
DOI: https://doi.org/10.11951/j.issn.1005-0299.20160408
2016-01-01
Abstract:In order to optimize the cooling parameters after homogenization, the microstructure and properties evolutions during the cooling processes have been investigated by in?situ electrical resistivity measurements, scanning electron microscopy ( SEM) , transmission electron microscopy ( TEM) , energy dispersive spectrometer ( EDS) and hardness test. The result has shown that the electrical resistivity curves have a good agreement with the precipitation behaviors. There were three types of precipitates in the studied alloy under different cooling conditions. And the precipitation sequence was equilibrium θ phase, metastable θ′ phase and θ″ phase. The hardness?time and resistivity?time curves revealed that choosing a suitable cooling condition could improve the microstructures and performance of the alloy. The optimal cooling time was exceeding 1 000 min, so that the hardness and resistivity of the alloy was located in a low level. However, the cooling should avoid being finished in the 19.4~184.1 min. The precipitation of θ″phase in this range would lead to the increasing of hardness and resistivity, which was harmful to the subsequent plastic working.
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