Research on Microstructures and Properties of Diffusion Bonding Joints for Inconel 718 Superalloy

HAN Wen-bo,ZHANG Kai-feng,WANG Guo-feng,WANG bo
DOI: https://doi.org/10.3969/j.issn.1005-0299.2005.03.025
IF: 1.8
2005-01-01
Materials Science and Technology
Abstract:Two kinds of diffusion bonding methods for fine-grain Inconel 718 superalloy——with no interlayer and with nickel foil used for the interlayer——have been studied. The diffusion factors affecting the quality of joint was analyzed at different parameters such as bonding temperature T, bonding pressure P and bonding time t. The microstructure and mechanical properties were analyzed by SEM、EPMA and optical microscopy. The optimum parameters for the diffusion bonding are: T=1050℃, P=20MPa, t=45min. Nickel foil with 25μm thick as interlayer was applied in the bonding joints.
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