Abstract:Monocrystalline silicon is the foundation of the computer industry, so it has a great significance to study the ultra-high precision machining of silicon. Molecular dynamics has been proved as a very effective method for the study of ultra-precision machining in nanoscale. During the grinding of brittle materials in nano-level, there are some unique phenomena such as brittle-ductile transition. To study the machining mechanism in nanometric grinding of monocrystalline silicon, the subsurface damage of < 0 0 1 > oriented Monocrystalline silicon under different grinding speeds were investigated by means of molecular dynamics simulations. The interactions between different atoms are described by the Morse and Tersoff potential. Based on analyzing the mechanism of diamond tool extrusion induced silicon lattice slip and distortion, the grinding process is explained. The movement of atoms and phase transformation are studied. The results show that there is not enough time for atoms beneath the tool to rearrange when increasing grinding speed at a low speed, which leads to the subsurface damage thickness decreases. When the diamond tool radius is small enough but still bigger than the undeformed chip thickness, the brittle-ductile transition can be achieved in the grinding region. And during the grinding process, the normal force is smaller than the tangential force. However, when the radius of the diamond tool increases to a certain value, the normal force could be larger than the tangential force.

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Tool Wear in Ultra-Precision Diamond Cutting of Non-Ferrous Metals with a Round-Nose Tool

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Study on the effect of laser-assisted machining on tool wear based on molecular dynamics simulation

Study on wear of diamond during scratching SiC using molecular dynamics simulations

Wear mechanism of diamond-cutting tool in nano-cutting polycrystalline γ-TiAl alloy based on molecular dynamics simulation

Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study

Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

Surface damage mechanism of monocrystalline silicon during single point diamond grinding

Coupled effect of tool geometry and tool-particle position on diamond cutting of SiCp/Al

Study on Subsurface Damage of Wafer Silicon Containing Through Silicon Via in Thinning

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

Impact of multiple abrasive particles on surface properties of SiC: A molecular dynamics simulation study