Performance analysis and optimization of thermoelectric cooling semiconductor lasers

Miao Sun,Limei Shen,Huanxin Chen,Ce Sang
2017-01-01
Abstract:With the rapid development of the semiconductor laser,it has been widely used in a great deal of fields,such as military、medical、industry、scientific research.It is of great significance to ensure the stability and reliability of the semiconductor laser,and the solution of the heat dissipation problem becomes increasingly crucial.Therefore,a physical model using thermoelectric cooling is established in finite element analysis software Icepak to conduct performance optimization.By comparing chip temperature of the laser using four kinds of heat dissipation solutions and different types of heat sinks to opti mize the heat dissipation performance of the model.Moreover,the model was verified by experiment.The results indicated that different cooling solutions can be selected at different ambient temperatures.With the combination of the thermoelectric cooler (TEC) 、heat sink and the cooling fan,the temperature of the chip can be kept at normal operating range of 30℃ ~45℃.
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