Performance Research of a Semiconductor Cooling Device with Solid Desiccant

Zheng Yuwei,Liu Xiaohua,Tu Rang

DOI: https://doi.org/10.3969/j.issn.0253-4339.2013.05.059

2013-01-01

Abstract:emiconductor refrigeration,known as thermoelectric refrigeration,is applied widely in fields such as industrial production and daily life,due to the advantages of rapid cooling and easy control.The heat dissipation on the hot side is the principle element restricting the coefficient of semiconductor refrigeration.In conventional device,dehumidification is realized by condensing dehumidification method,which lowers the temperature of the cold side of semiconductor and hence restricts the system COP.The semiconductor refrigeration model with heat pipe and solid desiccant is built in this paper,and verified by the experimental results of a 6-stage semiconductor refrigeration equipment with heat pipes.Then the model is used to predict the cooling and dehumidification performances with solid desiccant.The COP of the proposed semiconductor refrigeration system is 1.78,which is much higher than that shown in literature with condensing dehumidification under the same dehumidification amount.