Abstract:Conductive polymers have a vast market in integrated circuits (IC) and microsystems packaging to enhance mechanical, thermal, electrical performance, and cost effectiveness[1]. Isotropically conductive adhesives (ICAs) have been explored for attaching encapsulated surface mount components on rigid and flexible printed circuits [2]. However, the practical use of conductive adhesives in surface mount applications is limited because of the weak electric conductivity. Jiang et al [3] used nano-sized silver particles as a candidate for conducting filers in order to reduce the sintering temperature, but the contact resistance is still high. Some groups [4, 5] studied a series of methods such as using carboxylic acid group containing chemicals as surfactants to enhance the conductivity of ICAs in a variety of conditions, but because the micron-sized silver fillers have a high sintering temperature, the enhancement in conductivity is still limited. In order to further improve the conductivity of ICAs and minimize the cost, we experimented on a series of materials for silver surface pretreatment. We noticed an about 20 times improvement in conductivity of the modified ICA than the control sample (75% silver content in all samples). The volume resistivity of the optimum formulation reached the level of 10-6 Omegaldrcm. We also analyzed the adhesion strength and thermal property of the modified ICA material. The study indicated that both the electrical properties and the mechanical property were improved without negatively affecting the other physical properties, and they are both remain stable after subjecting to the 85degC and 85% relative humidity conditioning test.

Effect of Prepolymer and Reactive Diluent on the Properties of UV Curable Polyurethane-Based Conductive Silver Paste

Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Preparation, structure and properties of high performance silver-filled UV-curable polyurethane acrylate conductive inks

Effects of Active Diluents on Solidifying Process of UV-curing Reaction for Polyurethane Acrylate

Effect of Diluent on Ultra-low Temperature Curable Conductive Silver Adhesive

Synthesis and Characteristic Valuation of a Thermoplastic Polyurethane Electrode Binder for In-Mold Coating

Effect of Nano-Sized Silver Particles on the Resistivity of Polymeric Conductive Adhesives

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications

Effects of polyester resin molecular weight on the performance of low temperature curing silver pastes

Preparation and characterization of low temperature curing conductive silver paste for screen printing

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Effect of Polymer Binder on the Transparent Conducting Electrodes on Stretchable Film Fabricated by Screen Printing of Silver Paste

Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

Preparation and characterization of Ag conductive adhesive with low resistivity

Investigation of 1-hexanol base silver paste formula for low-temperature sintering