Abstract:With the current explosive growth of communication technologies and a wide variety of applications being found for broadband and high frequency of electronic components, LTCC (Low Temperature Cofired Ceramics and Ferrites) with materials that possess special characteristics have been rapidly developed, due to its greater multifunctionality, higher performances, sub-miniaturization and excellent reliability. As one of the most important passive components, the chip inductor with high inductances used in high frequency has attracted significant interests in 3-D miniaturized systems. This paper focuses on the design and fabrication of a chip inductor based on the ZnTi-substituted hexaferrite BaFe12O19 by LTCC technology to realize the 0805 size of standard packaging for high frequency applications. Testing results show that the value of inductor is 2.45uH and cut-off frequency is 548MHz. And the measured results agree with the simulated data basically, which indicates that the samples can satisfy the need of high frequency inductors. The influences of each factor on the performances of inductor are also analyzed. It is an effective method to resolve the consistency problems between simulation and manufacture.

Simulation Optimizing and Preparation of LTCC Multilayer Bandpass Filter

Design of multilayer triangular substrate integrated waveguide filter in LTCC

FDTD modeling of 3D metal-LTCC structures for RF(MM)ICs

A Novel Ltcc Multilayer Siw Linear Phase Filter

Design of X-band Hi-Lo Microstrip Low-pass Filters

Compact cross-coupled circular cavity filters using multilayer substrate integrated waveguide

Design of a Miniaturized Dual-Band Double-Folded Substrate Integrated Waveguide Bandpass Filter with Controllable Bandwidths

Broadband Filter Based on Stub-Loaded Ridge Substrate Integrated Waveguide (SIW) in Low Temperature Cofired Ceramic (LTCC)

Design of band-pass filter on different materials in LTCC/LTCF technology

The Study of Dielectric Properties of ZnO-TiO2 Microwave Ceramic Sinterd at Low-temperature and Chip Multilayer Bandpass Filter

Single Field HIE FDTD Solver with Nonuniform Grid Stratagem for More Fine Structure

The design and fabrication of LTCC chip inductors for high frequency applications based on barium ferrites

Ultra-Low-Loss Millimeter-Wave LTCC Bandpass Filters Based on Flexible Design of Lumped and Distributed Circuits.

Simulation and design of double coaxial microwave dielectric filter

Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method

Design of On-Chip Dual-Band Bandpass Filter Using Lumped Elements in LTCC Technology

Design of a RF MEMS Passive LC Filter

Numeric Analysis and Computer Simulation of Multilayer Chip Ferrite Beads

Structure Design and Simulation of a 2400 MHz Microwave Dielectric Dual-Mode Filter

A Miniaturized C-B and SIW Bandpass Filter based on LTCC

Synthesis and Design of LTCC Filtering Balun With Wide Stopband