Abstract:Voltage contrast (VC) has been a powerful tool for the failure analysis of integrated circuits and multichip module. As the packing density of printed circuit board (PCB) is increasing, conventional failure analysis methods to detect open or short circuit in PCBs are no longer adequate, and voltage contrast method could be a method for this purpose. However, unlike the cases of integrated circuits and multichip module, there are many areas in PCB that will produce serious charging effect when examine under the scanning electron microscope. One of the areas is the presence of solder mask on PCB.This work examines the feasibility of using voltage contrast for PCB failure analysis. Specially designed PCB is used for experimentation, and it is found that positive bias on one track and zero bias on another copper track provide a better image contrast as compared to negative and zero biases on the tracks. Also, the variation of the image contrast with different spacing between inter copper tracks has studied. It is found that the variation depends on the presence of solder mask and its location. The variation can be very different for negative bias case as compared to the positive bias case.Finite element analysis is also performed to explain the experimental observations. All the observations can be well explained by the charging effect of the solder masks. The charging effect of solder mask is indeed very significant in affecting the image contrast, and it could reduce the contrast to almost zero in some cases. (c) 2005 Elsevier Ltd. All rights reserved.

STUDY IN ELECTROMAGNETIC COMPATIBILITY ON PRINTED CIRCUIT BOARD OF SWITCHING POWER SUPPLY

A Novel Approach Base on Electric Field Analysis to Reduce Crosstalk Problem on PCB

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

Computation of Transient Electromagnetic Field Emission from Enclosure During GIS Disconnector Switching Operations

Efficient Analysis of Radiated Immunity of Printed Circuit Boards Using SPICE

Effects of printed-circuit-board layout on power switch case-to-ambient thermal resistance

A Novel Electromagnetic Bandgap Design Applied for Suppression of Printed Circuit Board Electromagnetic Radiation

An EM Imaging Method Based on Plane-Wave Spectrum and Transmission Line Model

Study on Electromagnetic Compatibility Problem of Print Circuit Board

Study on the conducted EMI due to radiated coupling in SMPS

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Status Of Electromagnetic Compatibility Research In Power Electronics

EMI and EMC Analysis of Arbitrarily Shaped Power-Ground Planes

Reduction of Crosstalk on Printed Circuit Board Using Genetic Algorithm in Switching Power Supply

Switching Noise Analysis for Conducted Electromagnetic Interference from of Power Electronic Module

Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

PCB Electromagnetic Interference Modelling Based on Reciprocity Theorem

Quantification of EMI for Power-Ground Plane and Novel EBG Structure for SSN Suppression

Numerical Characterization And Evaluation Of Esd Induced Field And Coupling On Interconnection Cable