Near-Field Scanning Based Shielding Effectiveness Analysis of System in Package
Li Ding,Xing-Chang Wei,Zhi-Yong Tang,Jun Wen,Liang Gao,Richard Xian-Ke Gao
DOI: https://doi.org/10.1109/tcpmt.2021.3096148
2021-01-01
Abstract:The electromagnetic interference (EMI) problems are crucial for system-in-package (SiP) due to the high demand of miniaturization and dense integration. Shielding methods are generally employed to protect SiP from EMI, through assessing the key performance index, i.e., shielding effectiveness (SE). In this article, the SE of a SiP is evaluated by using near-field scanning method. The SEs derived by using maximum near-field values and average near-field values are comparatively analyzed. The difference in near-field patterns of the unshielded and shielded SiPs may incur overestimation of the SE by using maximum field values. Both simulation and measurement results manifest that the gap between SiP and printed circuit board (PCB) will significantly change the radiation pattern of a shielded SiP, and thus has a great impact on the SE, especially when the frequency is above 1 GHz. However, a good correlation is found between the SE based on average near-field and the SE derived from the radiated power. This study has revealed the near-field shielding properties of SiP, which is helpful for building and analyzing the correlation among the SEs measured by different methods, including the near-field scanning, transverse electromagnetic (TEM) cell and reverberation chamber.