A low cost and high temperature resistant PU adhesive synthesized by Mw-controllable polyarylester

Ning Li,Dezhi Qu,Jianjun Zhang,Jinzhao Huo,Yongping Bai
DOI: https://doi.org/10.13416/j.ca.2017.07.024
2017-01-01
Abstract:With BPA (bisphenol-A)/NaOH (sodium hydroxide) aqueous solution,BTEAC (benzyl triethyl ammonium chloride),4,4-dicarboxyl diphenyl ether/dichloromethane solution as raw materials,a new PAR (polyarylester) was synthesized by phase transfer interface polycondensation at room temperature.Then,with PAR as soft chain segment,MDI (4,4-diphenyl methane diisocyanate) as hard chain segment,a two-component high temperature resistant PU (polyurethane) adhesive was prepared.The research results showed that the PAR's Mw was relatively maximal (130 000) when molar ratio of n (NaOH) ∶ n (BPA) was 2.4 ∶ 1,and reaction time was 24 h.The thermal decomposition temperature (350 ℃) and 600 ℃ carbon residue rate (35%) of the new two-component PU adhesive were obviously higher than those of traditional PU adhesive (165 ℃,8%),and it has the relatively optimal gel time,high temperature bonding properties and high temperature mechanical properties when mass ratio of m(first component)∶m(second component) was 100∶90.
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