The Effects of Components and Heat Treatment Temperature on Bond Property for Phenolic Resin-Based Adhesive

Feng ZHANG,Guanghai WANG,Shichao ZHANG,Haoran SUN,Chuanqi HU,Yufeng CHEN
DOI: https://doi.org/10.13957/j.cnki.tcxb.2017.05.018
2017-01-01
Journal of Ceramics
Abstract:In this paper, the high temperature binder was prepared by dissolving different components, such as silica, zirconium diboride and boron carbide. After low temperature (150 ℃ or less) curing, SiC samples were bonded by the binder. The samples were subjected to treat at different temperatures (400 ℃, 800 ℃, 1200 ℃, 1500 ℃) under an inert atmosphere. The microstructures of the samples were observed by optical microscope and scanning electron microscope. The effects of the modified filler and heat treatment temperature on the bond strength of the phenolic resin based adhesive were investigated. The results show that the bonding strength of the boron carbide modified phenolic resin based adhesive is high. When the heat treatment temperature is above 1200 ℃, the bond strength increases with the addition of boron carbide.
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