The Deposition of Superconducting TiN Thin Film by Using DC Magnetron Sputtering

Zhiping CHEN,Chunhai CAO,Haiping WANG,Yongchao LI,Lin KANG,Weiwei XU,Jian CHEN,Guozhu SUN,Peiheng WU
DOI: https://doi.org/10.13380/j.cnki.chin.j.lowtemp.phys.2017.03.002
2017-01-01
Abstract:By using DC magnetron sputtering,we deposited TiN thin film on the high resistance silicon substrate at room temperature.Respectively setting the sputtering power,the sputtering pressure and the gas flow rate of N2 and Aras separate variable,we obtained the samples with different parameters.The superconducting critical temperature (Tc) of the sample is between 3.2 to 4.0 K measured by the comprehensive physical property measurement system (PPMS).Then we got the dependence of Tc on each variable.X-ray diffraction (XRD) is used to analysis (111)TiN(FWHM),the lattice constant(a) and the relationship with each variable.By using atomic force microscope (AFM),we can find that sputtering power has a significant influence on the roughness of the surface.The best roughness (RES) is 1.716 nm.
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