Effect of Sb and Ni Addition on Microstructure and Mechanical Properties of SAC1205 Solder

Yibo Wang,Jicun Lu,Ming Li,Liming Gao

DOI: https://doi.org/10.1109/icept50128.2020.9201932

2020-01-01

Abstract:This paper addresses the effect of Sb and Ni addition on microstructure and mechanical properties of SAC1205 (Sn1.2%Ag0.5%Cu) solder. The objective is to add 0.5%Sb and 0.05%Ni into SAC1205 solder and improve its thermal cycling performance. Solder alloys were made by directly melting pure metal of all elements. Subsequently, tensile test samples in dog bone shape were manufactured by wire cutting. Tensile tests were performed at strain rates of 5E-5/s, 5E-4/s, 5E-3/s, 2E-2/s and 1E-1/s in chamber with temperatures of 25°C, 75°C, 100°C and 125°C. It was confirmed that the Sb and Ni addition enhances SAC 1205 solder rigidity and tensile strength at the strain rates and temperatures. The enhancement was believed to come from the solution strengthening and particle strengthening of Sb and Ni addition. Solder tensile test fracture was examined by SEM. It was found that Sb and Ni addition could transfer brittle fracture mode to ductile fracture mode at 25°C under the strain rate of 1E-1/s, which is probably attributed to the grain refinement effect of element addition. It is expected that the Sb and Ni addition improves thermal cycling performance of SAC1205 solder.