Abstract:Transistor compact model (TCM) is the key bridge between process technology and circuit design. Typically, TCM is desired to capture the nonlinear device electronic characteristics and their high-order derivatives. However, for the novel devices in advanced and future technologies, establishing TCM based on analytical equations and extracting model parameters becomes tedious. The model fitting capability for device outputs' high-order derivatives is also limited. These drawbacks hinder fast and accurate device to circuit evaluation cycles. We develop a TCM based on multigradient neural network (MNN) using computational graph in the PyTorch framework. This MNN model is able to simultaneously capture the transistor dc/ac characteristics, such as I-V/Q-V, their derivatives (G-V/C-V), and higher order derivatives accurately. Moreover, the model architecture can be widely adapted to various device types. Based on this model scheme, software is developed to enable the automated model generation for standard SPICE simulation. Finally, the model and software are validated for novel gate-all-around (GAA) Si cold source field-effect transistors (CSFET), and 19-stage ring oscillator and two-stage operational amplifier circuit simulations have also been demonstrated. This work reduces the cycle of novel device compact model creation and circuit benchmark simulation from months or weeks to hours. In addition, it enables more precise circuit simulation for analog and RF circuits, and it provides a rapid solution for early stage design technology cooptimization (DTCO).

A New Method to Correlate Human Body Model and Transmission Line Pulse Based on RC Thermal Equivalent Model

Real‐time Calculation of Three Core Cable Conductor Temperature Based on Thermal Circuit Model with Thermal Resistance Correction

Efficient Evaluation of the Scattered Field Radiated by Transmission Line Cables

Accurate Evaluation of Transmission Line Model at Higher Frequencies for Characterising Field-to-Wire Coupling of Coated Twisted-Wire Pair with a Grounded Conductor

Analysis of Wave Propagation on Human Body Based on Stratified Media Model

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Modeling and Correlation of Two Thermal Paths in Frequency-Domain Thermal Impedance Model of Power Module

A Coupled 3D Finite Element-Circuit Model for the Numerical Analysis of Small Time Scale Transients of an Insulated Gate Bipolar Transistor Power Electronics Device

Electrical-thermal Co-Analysis of Through Silicon Via with Equivalent Circuit Model

A system-level equivalent circuit method for the electrical performance modeling of electronic packages

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin.

An Electrothermal Model of Interconnects Based on a Transmissionline Network

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

A Network Topological Approach-Based Transient 3-D Electrothermal Model of Insulated-Gate Bipolar Transistor

A 5-Tissue-layer Lumped-Element Based HBC Circuit Model Compatible to IEEE802.15.6.

Application of a SPICE Model for Multiconductor Transmission Lines in Electromagnetic Topology

An Analysis Method of System-Level ESD Model with a TLP Stress Input

Transistor Compact Model Based on Multigradient Neural Network and Its Application in SPICE Circuit Simulations for Gate-All-Around Si Cold Source FETs

An Equivalent Heat Transfer Model Instead of Wind Speed Measuring for Dynamic Thermal Rating of Transmission Lines

Thermal Analysis Model Inside MOSFETs under HPEMPs Based on the Thermal Flux Boundary Condition

A Five-Tissue-Layer Human Body Communication Circuit Model Tunable to Individual Characteristics