Preparation and Properties of Ni-Si-O Thin Film Prepared by Sol-Gel Method

Rongjuan Zhao,Yuanhua Lin,Jingnan Cai,Ce-Wen Nan,Dan Xie
DOI: https://doi.org/10.4028/www.scientific.net/kem.336-338.799
2007-01-01
Abstract:Ni-Si-O thin films on Si substrate have been prepared by a sol-gel method. The microstructure and phase composition of the films were investigated by XRD, SEM, FTIR. The XRD results showed that the films are amorphous while annealed at 800 degrees C for 10 min, the SEM imagines proved that the films are smooth and thickness is about 190 nm. Electrical property of the film indicated that the leakage current was as low as 10(-6) A/cm(2) at an electric field of 1MV/cm. The dielectric properties of Ni-Si-O thin films can be improved as increasing the annealed temperature.
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