Orthogonal Design of Multilayer Thin Film Residual Stress Impact on the Thz Micro Bridge Deformation

Zheng Xing,Liu Zi-Ji,Gu De-En,Gou Jun,Ma Jia-Feng,Li Wei-Zhi,Wu Zhi-Ming
DOI: https://doi.org/10.11972/j.issn.1001-9014.2016.03.013
2016-01-01
JOURNAL OF INFRARED AND MILLIMETER WAVES
Abstract:Residual stress matching is critical for elimination of deformation for terahertz (THz) microbolometer with micro-bridge structure. Finite element simulation model of micro-bridge was built with a pixel size of 35 mu m x 35 mu m. Intellisuite was used for mechanics simulation based on orthogonal experimental design. A minimum deformation of 0.0385 mu m was obtained with an optimized stress combination when the residual stresses of support layer, passivation layer, electrode layer, sensitive layer and absorption layer were +200 MPa, +200 MPa, +200 MPa, 0 MPa and -400 MPa, respectively. 320 x 240 THz focal plane array was fabricated with the optimized stress combination. A minimal deformation was achieved, which agreed well with the simulation.
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