Abstract:The hot-section parts easily occur the creep-fatigued interaction under the condition of mechanicalthermal coupled load during the period of service, which may lead to the damage of the parts, and therefore, the measurement and characterization of thermal-deformed fields of the parts are important to understand its damage process. Aiming at relevant demand, the bilateral telecentric-multispectral imaging system was established, the research of synchronous measurement technique of the temperature and deformation fields was developed. On the one hand, the measurement technology for surface temperature of the object was developed using the two-color images captured by the multispectral camera with bilateral telecentric lens and combined with colorimetric method. On the other hand, the 2 D-DIC measurement technique of the multispectral camera was developed by conducting digital image correlation analysis using the blue light images before and after deformation, which can measure the high temperature deformation field of the object（the blue light images were filtered by multispectral camera）.Results showed that the bilateral telecentric lens is used to replace the ordinary optical lens for imaging,which can effectively eliminate the distortion of the multispectral imaging system. Since the temperature measurement process of this measurement system is little affected by the emissivity of the object, therefore, it has excellent robustness. The thermal expansion coefficients of the nickel alloys are evaluated at the temperature ranges of 700–1000℃, indicating this system can achieve the synchronous and precise measurement of the temperature and deformation fields of the object.

Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element

On the Propagation and Pulsation of Portevin-Le Chatelier Deformation Bands: an Experimental Study with Digital Speckle Pattern Metrology

Finite Element Analysis on a Circular Wedge Prism with 400 Mm Diameter

Study on the Micro-Deformation Evolution Properties of Copper Bicrystals by Digital Speckle Correlation Metrology

Deformation Measurement of A Small Component and A Thin Film Using Time Sequence Speckle Pattern Interferometry

MEASUREMENT OF DEFORMATION OF PURE Ni FOILS BY SPECKLE PATTERN INTERFEROMETRY

Measurements for Displacement and Deformation at High Temperature by Using Edge Detection of Digital Image.

Residual thermo-creep deformation of copper interconnects by phase-shifting SEM Moiré method

High-Precision Large Deflection Measurements of Thin Films Using Time Sequence Speckle Pattern Interferometry

Research on Synchronous Measurement Technique of Temperature and Deformation Fields Using Multispectral Camera with Bilateral Telecentric Lens

Real-Time and Full-Field Deflection Measurement of Thin Films Electroplated on the Single Crystal Silicon Wafers

Study on the High Temperature Deformation Measurement Using the Mark Shearing Technique

Theoretical Analysis and Simulation of Thermoelastic Deformation of Bimorph Microbeams

Applications of Speckle Metrology to Vibration and Deformation Measurements of Electronic Devices

In Situ and Real-Time Tensile Testing of Thin Films Using Double-Field-of-view Electronic Speckle Pattern Interferometry

Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method

Temperature and Deformation Measurement for Large-Scale Flat Specimens Based on Image Mosaic Algorithms.

Deformation analysis in microstructures and micro-devices

Dynamic Deformation Measurement Of Specular Surface With Deflectometry And Speckle Digital Image Correlation

Simultaneous 3D measurement of deformation and its first derivative with speckle pattern interferometry and shearography

Micro 3D Measurement Applied to Interfacial Deformation of Bilayer Thin Film/substrate Structure under Thermal Cycling Loads