Abstract:Under mechanical loading, the strain hardening behavior of crystalline face-centered cubic (FCC) metals is of critical importance in determining fracture behavior and overall mechanical performance. While strain hardening is typically accompanied by a decrease in ductility, it can also simultaneously enhance the material's resistance to plastic deformation and improve its load bearing capacity. Hence, we conducted a detailed study using copper (Cu) single-crystal micropillars as a model system to investigate and delineate the relationship between strain hardening and defect behavior. We employed in situ compression in a scanning electron microscope (SEM) and dislocation density-based crystal plasticity (DCP) modeling. The strain hardening rate varied with the compression crystallographic orientation, ranging from negligible values (of approximately 80 MPa) to relatively high hardening rates (of approximately 1150 MPa) for nominal strains of up to 15%. Various analysis methods were applied, including slip trace characterization, electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), and transmission Kikuchi diffraction (TKD). These techniques allowed us to identify the distributions of active slip systems, dislocation structures after compression, and correlated internal lattice rotations. Furthermore, the DCP model was developed to specifically understand how serration events are related to dislocation-density evolution or strain bursts, and this was validated with the micropillar experiments. This integrated experimental and modeling investigation offers valuable insights and predictions regarding the evolution of both total and partial dislocations, including Hirth and Lomer junctions, as well as lattice rotations.

Evolution of dislocation mechanisms in single-crystal Cu under shock loading in different directions

Dislocation evolution and peak spall strengths in single crystal and nanocrystalline Cu

Shock-induced plasticity of semi-coherent 111 Cu-Ni multilayers

Collapse of stacking fault tetrahedron and dislocation evolution in copper under shock compression

New Mechanisms of Helical Dislocation Formation Via the Pinch-off Process Near a Nano-Inhomogeneity

Shock-induced Migration of Σ3〈110〉 Grain Boundaries in Cu

Effects of Orientation and Vacancy Defects on the Shock Hugoniot Behavior and Spallation of Single-Crystal Copper

Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions

Using Molecular Dynamic Simulation to Understand the Deformation Mechanism in Cu, Ni, and Equimolar Cu-Ni Polycrystalline Alloys

Molecular Insight into the Deformation of Single Crystal Copper Loaded by High-Speed Shock Wave

Understanding the Role of 1/2 ⟨110⟩ Dislocations in Deformation Mechanisms of Single-Crystal High-Entropy Carbide Ceramics from Machine Learning Force Field Simulations

Shock Response of Copper Bicrystals with a ∑3 Asymmetric Tilt Grain Boundary

Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Interplay between dislocation type and local structure in dislocation-twin boundary reactions in Cu

Effect of crystallographic orientations on shock-induced plasticity for CoCrFeMnNi high-entropy alloy

Atomistic Simulations for the Evolution of a U-shaped Dislocation in Fcc Al

Dynamic deformation of Al under shock loading

Molecular dynamics simulation on spallation of [111] Cu/Ni nano-multilayers: Voids evolution under different shock pulse duration

Dislocation Evolution in Cyclic‐Loaded Cu Nanopillars with Different Configurations

A fundamental understanding of how dislocation densities affect strain hardening behavior in copper single crystalline micropillars

Body-centered phase of shock loaded Cu