Design and Implementation of a Novel Skull Vibration Sensing Module for Bone Conduction Microphone

Bo-Cheng You,Sung-Cheng Lo,Chun-Kai Chan,Hsien-Lung Ho,Shih-Chia Chiu,Guan-Hong Hsieh,Weileun Fang
DOI: https://doi.org/10.1109/mems46641.2020.9056312
2020-01-01
Abstract:This study presents a packaged MEMS acoustic or air pressure sensing module (Fig. 1) to detect the skull vibration for bone conduction microphone (BCM) application. The proposed microphone design has two merits: (1) the packaged module (Fig. 1) enable the skull vibration detection using the MEMS sensor; (2) no sound port is required to remove the environmental and wind noise and to avoid the damage from dust and water (Fig. 1a). The device with the dimensions of 3.5×2.65×1.48 mm 3 is implemented using the packaging and assembly of existing MEMS sensor with polymer diaphragm and metal proof-mass. Measurements show the device has a sensitivity of -39.1dB/g, at 1kHz, and ±5dB bandwidth for 100Hz~6.7kHz. Frequency responses of different samples show good repeatability.
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