A new substrate for realizing hemispherical encapsulant layer to enhance light efficiency of light-emitting diodes

Puzhen Xia,Xingjian Yu,Xiaobing Luo
DOI: https://doi.org/10.1109/eptc47984.2019.9026637
2019-01-01
Abstract:Nowadays, light-emitting diodes (LEDs) have been widely applied in many light occasions. Encapsulant layer is of essential important to the light efficiency of LEDs. In this study, a new LED substrate with a outspread encapsulant coating area was designed for realizing hemispherical encapsulant layer. The fluid manipulation ability of the new substrate was investigated by numerical simulations based on the volume of fluid method, and the light efficiency enhancement of LED with the new substrate was verified by experiments. The simulated results show that compared to the conventional LED substrate, the new substrate holds similar to 3 times the volume of encapsulant without flow over the coating area, so it realizes hemispherical encapsulant layer easier. The experimental results show that compared to the flat encapsulant layer, the hemispherical encapsulatnt layer realized by the new substrate increases the light efficiency by 75% for the blue LED. We think this new substrate would be of great help to the development of LED packaging.
What problem does this paper attempt to address?