Abstract:Light-emitting diode (LED) is regarded as the green lighting source in 21st century due to its advantages of high efficiency,energy saving,environmental protection and compact size,etc.With the popularization and application of LED in more and more lighting occasions and the improvement of people's requirement for the quality of light source,more and more attention has been paid to the light quality of LED.The main indexes for evaluating the light quality of LED are the efficiency,angular color uniformity (ACU) and color rendering index (CRI),which are closely related to LED packaging.LED packaging is a process of assembling the chip and other packaging materials together to form the final lighting products,it plays a key role in mechanical protection,external signals and electrical connections,heat dissipation and light quality control.This paper makes a systematic exposition of the control technology of efficiency,ACU and CRI from the view of LED packaging,mainly involves three key packaging technologies:1) thermal management.For LED products,about 60％ of the input electrical power is converted to heat,therefore,the failure of the effectively heat dissipation would cause sharply increase of the temperature,which leads to the decrease of efficiency and induces reliability problems.2) Optical design.The LED light is generate by the electron-hole recombination from the active layer of the chip,then it across the chip,phosphor layer,encapsulant layer,lens and other packaging materials.Due to scattering,refraction and absorption of the packaging materials,the light propagation direction and path would be changed,and part of the light is absorbed and converted into heat.Therefore,the optical design not only can control the LED light energy distribution,but also can reduce the light absorption in the packaging materials to improve the efficiency.3) Phosphor coating.Compared to the multi-color LED chips packaging method,coating the monochromatic or polychromatic fluorescent powder on the LED chip to achieve white light is more popular and widely applied in the LED industrial due to its correlated color temperature (CCT) adjustability and process flexibility.For the phosphor-converted white LED,the phosphor coating plays a key role in deciding the ACU and CRI.

‘Flip Glass Substrate’ Package Technology for LED Yield and Performance Enhancement

Development of a “Flip Glass Substrate” LED package technology for color bin yield and view angle enhancement

Designs on Flip-Glass of LED Package for Selective Enhancement of Emitting-Intensity and View-Angle

Silicon based wafer-level packaging for flip-chip LEDs

A Cylindrical Tuber Encapsulant Geometry for Enhancing Optical Performance of Chip-on-Board Packaging Light-Emitting Diodes

Color-filtered Phosphor-in-glass for LED-lit LCD with Wide Color Gamut

Five-Surface Phosphor-in-Glass for Enhanced Illumination and Superior Color Uniformity in Large-View Scale LEDs

Effects of Phosphor’s Location on LED Packaging Performance

Effects of Packaging Structure on Optical Performances of Phosphor Converted Light Emitting Diodes

An Improved Substrate Structure for High Angular Color Uniformity of White Light-Emitting Diodes

ACU Enhancement of WLEDs Realized by Multilayer Phosphor with Convex Shape

Dip-transfer Phosphor Coating on Designed Substrate Structure for High Angular Color Uniformity of White Light Emitting Diodes with Conventional Chips

A sandwich structure of multi-chip COB LED with double flat glass boards coated with phosphors film by screen printing technique

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation

Effect of Phosphor Composition and Packaging Structure of Flexible Phosphor Films on Performance of White LEDs

Dynamic Phosphor Sedimentation Effect on the Optical Performance of White LEDs

LED Packaging for High Light Quality: Status and Perspectives

Enhancing Optical Performance of Chip-Scale Packaged White LEDs by Phosphor-in-Glass With High-Reflective Dam

Reliable and Efficient Phosphor-in-Glass-Based Chip-Scale Packaging for High-Power White LEDs

A Method for Geometry Control of Phosphor Layer in High-Power White LEDs by Package Structure

Investigation Of The Influence Of Ag Reflective Layer On The Correlated Color Temperature And The Angular Color Uniformity Of Led With Conformal Phosphor Coating