Abstract:A series of solution-processable and photosensitive polyimide (PSPI) coatings with enhanced high-temperature dimensional stability were designed, synthesized and characterized. For this purpose, the rigid-rod benzanilide (Ph − CONH − Ph) units with methyl substituents were incorporated into the molecular structures of an intrinsically auto-photosensitive PSPI system via the two-step chemical imidization copolymerization of a specially designed aromatic diamine, 2,3'-dimethyl-4,4'- diaminobenzanilide (MMDABA) and an aromatic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), together with an aromatic diamine, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane (TMMDA). The ortho-substituted methyl group in MMDABA, on one hand, was designed to guarantee the solubility of the derived PSPI resins in the organic solvents; and on the other hand, maintain the intrinsic photosensitivity of the pristine PSPI (BTDA-TMMDA, PSPI-1). Meanwhile, the rigid benzanilide unit was applied to reduce the coefficients of thermal expansions (CTE) of the derived PSPI coatings. Four PSPI copolymers with the TMMDA/MMDABA (molar ratio) of 95/5 (PSPI-2), 90/10 (PSPI-3), 85/15 (PSPI-4), and 80/20 (PSPI-5) were prepared. The derived PSPI resins were all soluble in polar aprotic solvents of N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). All the PSPI coatings maintained good photosensitivity to the ultraviolet (UV) light (UV-A, 320 ~ 460 nm) except PSPI-5, indicating the deterioration of the photosensitivity of the polymers by incorporation of MMDABA units. Incorporation of MMDABA units into the PSPI systems basically maintained the thermal stability of the polymers, while apparently increased the dimensional stability of the coatings at elevated temperatures. PSPI-5 possessed the CTE value of 42 × 10–6/K in the temperature range of 50 to 300 °C, which was obviously lower than that of the pristine PSPI-1 system (CTE = 56 × 10–6/K).

Recent progress in acrylate/acrylamide photosensitive polyimides: Synthesis and application

Advancements in Synthesis Strategies and Optoelectronic Applications of Bio-Based Photosensitive Polyimides

Quaternary Copolymerized Polyimides and Negative Photosensitive Polyimide: Preparation and Properties

Molecular Design of Photosensitive Polyimides for Microelectronics

Research and Development of Positive-working Photosensitive Polyimides(2)

Progress in the Polymerization of 1-Chloro-2-phenylacetylene Derivatives

Polyimides Containing Aliphatic/alicyclic Segments in the Main Chains

Investigating the structure–sensitivity relationship of photosensitive polyimide formulated by using a photobase generator

Recent development of polyimides: Synthesis, processing, and application in gas separation

Synthesis and Characterization of Novel Photosensitive Polyimide

Recent New Methodologies for Acetylenic Polymers with Advanced Functionalities.

Progress on the research and application of low-temperature curable photosensitive polyimides for microelectronic packaging

Preimidized auto-photosensitive polyimides containing methyl-substituted benzanilide units with increased high-temperature dimensional stability for advanced optical applications: preparation and properties

Recent Development of Photochromic Polymer Systems: Mechanism, Materials, and Applications

Recent Study Advances in Flexible Sensors Based on Polyimides

From Molecular Design to Practical Applications: Strategies for Enhancing the Optical and Thermal Performance of Polyimide Films

Autophotosensitive Negative Polyimide

Study on Chemical Graft Structure Modification and Mechanical Properties of Photocured Polyimide

Recent Advances in Fluorescent Polyimides

Expedient Access to Polysubstituted Acrylamides via Strain-Release-Driven Dual Phosphine and Palladium Catalysis

Synthesis and photoconductive characteristics of biphenylporphyrin-containing poly(amic acid)s and polyimides